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參數(shù)資料
| 型號： | HIP5500IB |
| 廠商： | INTERSIL CORP |
| 元件分類： | 功率晶體管 |
| 英文描述： | High Voltage IC Half Bridge Gate Driver |
| 中文描述： | 2 A HALF BRDG BASED MOSFET DRIVER, PDSO20 |
| 封裝： | PLASTIC, MS-013AC, SOIC-20 |
| 文件頁數(shù)： | 11/12頁 |
| 文件大?。?/td> | 922K |
| 代理商： | HIP5500IB |
11
HIP5500
E20.3
(JEDEC MS-001-AD ISSUE D)
20 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.210
-
5.33
4
A1
0.015
-
0.39
-
4
A2
0.115
0.195
2.93
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.045
0.070
1.55
1.77
8
C
0.008
0.014
0.204
0.355
-
D
0.980
1.060
24.89
26.9
5
D1
0.005
-
0.13
-
5
E
0.300
0.325
7.62
8.25
6
E1
0.240
0.280
6.10
7.11
5
e
0.100 BSC
2.54 BSC
-
e
A
e
B
L
0.300 BSC
7.62 BSC
6
-
0.430
-
10.92
7
0.115
0.150
2.93
3.81
4
N
20
20
9
Rev. 0 12/93
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between
English and Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
3. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated
in JEDEC seating plane gauge GS
-
3.
5. D, D1, and E1 dimensions do not include mold flash or protru-
sions. Mold flash or protrusions shall not exceed 0.010 inch
(0.25mm).
6. E and
are measured with the leads constrained to be per-
pendicular to datum
.
7. e
B
and e
C
are measured at the lead tips with the leads uncon-
strained. e
C
must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions.
Dambar protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3,
E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch
(0.76 - 1.14mm).
C
e
A
E
C
e
B
e
C
-B-
E1
INDEX
AREA
1 2
3
N/2
N
SEATING
PLANE
BASE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A1
-A-
0.010 (0.25)
C
A
M
B S
e
A
-C-
Dual-In-Line Plastic Packages (PDIP)
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