FN4315.16 November 4, 2005 HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E Shrink Small Outline Plastic Packages (SSOP) NO" />
鍙冩暩璩囨枡
鍨嬭櫉锛� HIN207ECB
寤犲晢锛� Intersil
鏂囦欢闋佹暩锛� 11/22闋�
鏂囦欢澶�?銆�?/td> 0K
鎻忚堪锛� IC 5DRVR/3RCVR RS232 5V 24-SOIC
妯欐簴鍖呰锛� 30
椤炲瀷锛� 鏀剁櫦(f膩)鍣�
椹呭嫊鍣�/鎺ユ敹鍣ㄦ暩锛� 5/3
瑕�(gu墨)绋嬶細 RS232
闆绘簮闆诲锛� 4.75 V ~ 5.25 V
瀹夎椤炲瀷锛� 琛ㄩ潰璨艰
灏佽/澶栨锛� 24-SOIC锛�0.295"锛�7.50mm 瀵級
渚涙噳鍟嗚ō鍌欏皝瑁濓細 24-SOIC
鍖呰锛� 绠′欢
19
FN4315.16
November 4, 2005
HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E
Shrink Small Outline Plastic Packages (SSOP)
NOTES:
1. Symbols are defined in the 鈥淢O Series Symbol List鈥� in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension 鈥淒鈥� does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.20mm
(0.0078 inch) per side.
4. Dimension 鈥淓鈥� does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.20mm (0.0078 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. 鈥淟鈥� is the length of terminal for soldering to a substrate.
7. 鈥淣鈥� is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension 鈥淏鈥� does not include dambar protrusion. Allowable dambar
protrusion shall be 0.13mm (0.005 inch) total in excess of 鈥淏鈥� dimen-
sion at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
C
H
0.25(0.010)
B
M
0.25
0.010
GAUGE
PLANE
A2
M24.209 (JEDEC MO-150-AG ISSUE B)
24 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.312
0.334
7.90
8.50
3
E
0.197
0.220
5.00
5.60
4
e
0.026 BSC
0.65 BSC
-
H
0.292
0.322
7.40
8.20
-
L
0.022
0.037
0.55
0.95
6
N24
24
7
0o
8o
0o
8o
-
Rev. 1
3/95
鐩搁棞PDF璩囨枡
PDF鎻忚堪
HIN207ECA-T IC 5DRVR/3RCVR RS232 5V 24-SSOP
HIN207CB-T IC 5DRVR/3RCVR RS232 5V 24-SO
HIN207CB IC 5DRVR/3RCVR RS232 5V 24-SO
HIN207CA IC 5DRVR/3RCVR RS232 5V 24-SSOP
HIN206EIAZA-T IC 4DRVR/3RCVR RS232 5V 24-SSOP
鐩搁棞浠g悊鍟�/鎶€琛撳弮鏁�
鍙冩暩鎻忚堪
HIN207ECB-T 鍔熻兘鎻忚堪:IC 5DRVR/3RCVR RS232 5V 24-SOIC RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 鎺ュ彛 - 椹呭嫊鍣紝鎺ユ敹鍣�锛屾敹鐧�(f膩)鍣� 绯诲垪:- 妯欐簴鍖呰:1,000 绯诲垪:- 椤炲瀷:鏀剁櫦(f膩)鍣� 椹呭嫊鍣�/鎺ユ敹鍣ㄦ暩:2/2 瑕�(gu墨)绋�:RS232 闆绘簮闆诲:3 V ~ 5.5 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 灏佽/澶栨:16-SOIC锛�0.295"锛�7.50mm 瀵級 渚涙噳鍟嗚ō鍌欏皝瑁�:16-SOIC 鍖呰:甯跺嵎 (TR)
HIN207ECBZ 鍔熻兘鎻忚堪:RS-232鎺ュ彛闆嗘垚闆昏矾 RS232 5V 5D/3R 15KV 24 COM RoHS:鍚� 鍒堕€犲晢:Exar 鏁告摎閫熺巼:52 Mbps 宸ヤ綔闆绘簮闆诲:5 V 闆绘簮闆绘祦:300 mA 宸ヤ綔婧害鑼冨湇:- 40 C to + 85 C 瀹夎棰ㄦ牸:SMD/SMT 灏佽 / 绠遍珨:LQFP-100 灏佽:
HIN207ECBZ-T 鍔熻兘鎻忚堪:RS-232鎺ュ彛闆嗘垚闆昏矾 RS232 5V 5D/3R 15KV 24 COM RoHS:鍚� 鍒堕€犲晢:Exar 鏁告摎閫熺巼:52 Mbps 宸ヤ綔闆绘簮闆诲:5 V 闆绘簮闆绘祦:300 mA 宸ヤ綔婧害鑼冨湇:- 40 C to + 85 C 瀹夎棰ㄦ牸:SMD/SMT 灏佽 / 绠遍珨:LQFP-100 灏佽:
HIN207ECP 鍒堕€犲晢:Rochester Electronics LLC 鍔熻兘鎻忚堪:- Bulk
HIN207EIA 鍒堕€犲晢:Rochester Electronics LLC 鍔熻兘鎻忚堪:RS232 5V 5D/3R 15KV 24SSOP IND - Bulk