FN4315.16 November 4, 2005 HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E Shrink Small Outline Plastic Packages (SSOP)" />
鍙冩暩(sh霉)璩囨枡
鍨嬭櫉锛� HIN202EIBN
寤犲晢锛� Intersil
鏂囦欢闋佹暩(sh霉)锛� 14/22闋�
鏂囦欢澶�?銆�?/td> 0K
鎻忚堪锛� IC TXRX RS-232 5V ESD 16-SOIC
妯欐簴鍖呰锛� 48
椤炲瀷锛� 鏀剁櫦(f膩)鍣�
椹�(q奴)鍕曞櫒/鎺ユ敹鍣ㄦ暩(sh霉)锛� 2/2
瑕�(gu墨)绋嬶細 RS232
闆绘簮闆诲锛� 4.5 V ~ 5.5 V
瀹夎椤炲瀷锛� 琛ㄩ潰璨艰
灏佽/澶栨锛� 16-SOIC锛�0.154"锛�3.90mm 瀵級
渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁濓細 16-SOIC
鍖呰锛� 绠′欢
鐢�(ch菐n)鍝佺洰閷勯爜闈細 1239 (CN2011-ZH PDF)
21
FN4315.16
November 4, 2005
HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E
Shrink Small Outline Plastic Packages (SSOP)
NOTES:
1. Symbols are defined in the 鈥淢O Series Symbol List鈥� in Section 2.2
of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension 鈥淒鈥� does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.20mm (0.0078 inch) per side.
4. Dimension 鈥淓鈥� does not include interlead flash or protrusions.
Interlead flash and protrusions shall not exceed 0.20mm (0.0078
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. 鈥淟鈥� is the length of terminal for soldering to a substrate.
7. 鈥淣鈥� is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension 鈥淏鈥� does not include dambar protrusion. Allowable
dambar protrusion shall be 0.13mm (0.005 inch) total in excess of
鈥淏鈥� dimension at maximum material condition.
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
INDEX
AREA
E
D
N
12
3
-B-
0.25(0.010)
C A
M
BS
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
C
H
0.25(0.010)
B
M
0.25
0.010
GAUGE
PLANE
A2
M28.209 (JEDEC MO-150-AH ISSUE B)
28 LEAD SHRINK SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.078
-
2.00
-
A1
0.002
-
0.05
-
A2
0.065
0.072
1.65
1.85
-
B
0.009
0.014
0.22
0.38
9
C
0.004
0.009
0.09
0.25
-
D
0.390
0.413
9.90
10.50
3
E
0.197
0.220
5.00
5.60
4
e
0.026 BSC
0.65 BSC
-
H
0.292
0.322
7.40
8.20
-
L
0.022
0.037
0.55
0.95
6
N28
28
7
0掳
8掳
0掳
8掳
-
Rev. 2 6/05
鐩搁棞(gu膩n)PDF璩囨枡
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HIN202EIBN-T 鍔熻兘鎻忚堪:IC 2DRVR/2RCVR RS232 5V 16-SOIC RoHS:鍚� 椤炲垾:闆嗘垚闆昏矾 (IC) >> 鎺ュ彛 - 椹�(q奴)鍕曞櫒锛屾帴鏀跺櫒锛屾敹鐧�(f膩)鍣� 绯诲垪:- 妯欐簴鍖呰:1,000 绯诲垪:- 椤炲瀷:鏀剁櫦(f膩)鍣� 椹�(q奴)鍕曞櫒/鎺ユ敹鍣ㄦ暩(sh霉):2/2 瑕�(gu墨)绋�:RS232 闆绘簮闆诲:3 V ~ 5.5 V 瀹夎椤炲瀷:琛ㄩ潰璨艰 灏佽/澶栨:16-SOIC锛�0.295"锛�7.50mm 瀵級 渚涙噳(y墨ng)鍟嗚ō(sh猫)鍌欏皝瑁�:16-SOIC 鍖呰:甯跺嵎 (TR)
HIN202EIBNZ 鍔熻兘鎻忚堪:RS-232鎺ュ彛闆嗘垚闆昏矾 RS232 5V 2D/2R 15KV 0.1UF 16NSOIC IND RoHS:鍚� 鍒堕€犲晢:Exar 鏁�(sh霉)鎿�(j霉)閫熺巼:52 Mbps 宸ヤ綔闆绘簮闆诲:5 V 闆绘簮闆绘祦:300 mA 宸ヤ綔婧害鑼冨湇:- 40 C to + 85 C 瀹夎棰�(f膿ng)鏍�:SMD/SMT 灏佽 / 绠遍珨:LQFP-100 灏佽:
HIN202EIBNZ 鍒堕€犲晢:Intersil Corporation 鍔熻兘鎻忚堪:Transceiver IC
HIN202EIBNZ-T 鍔熻兘鎻忚堪:RS-232鎺ュ彛闆嗘垚闆昏矾 RS232 5V 2D/2R 15KV 0 1UF 16N IND RoHS:鍚� 鍒堕€犲晢:Exar 鏁�(sh霉)鎿�(j霉)閫熺巼:52 Mbps 宸ヤ綔闆绘簮闆诲:5 V 闆绘簮闆绘祦:300 mA 宸ヤ綔婧害鑼冨湇:- 40 C to + 85 C 瀹夎棰�(f膿ng)鏍�:SMD/SMT 灏佽 / 绠遍珨:LQFP-100 灏佽:
HIN202EIBNZ-T7A 鍔熻兘鎻忚堪:RS-232鎺ュ彛闆嗘垚闆昏矾 RS232 5V 2D/2R 15KV 0 1UF 16N INDE RoHS:鍚� 鍒堕€犲晢:Exar 鏁�(sh霉)鎿�(j霉)閫熺巼:52 Mbps 宸ヤ綔闆绘簮闆诲:5 V 闆绘簮闆绘祦:300 mA 宸ヤ綔婧害鑼冨湇:- 40 C to + 85 C 瀹夎棰�(f膿ng)鏍�:SMD/SMT 灏佽 / 绠遍珨:LQFP-100 灏佽: