- 您現(xiàn)在的位置：買賣IC網(wǎng) > PDF目錄10779 > HI5960IB (Intersil)IC DAC 14-BIT 130MSPS 28-SOIC PDF資料下載
參數(shù)資料
| 型號(hào)： | HI5960IB |
| 廠商： | Intersil |
| 文件頁數(shù)： | 3/12頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC DAC 14-BIT 130MSPS 28-SOIC |
| 標(biāo)準(zhǔn)包裝： | 26 |
| 設(shè)置時(shí)間： | 35ns |
| 位數(shù)： | 14 |
| 數(shù)據(jù)接口： | 并聯(lián) |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 電壓電源： | 模擬和數(shù)字 |
| 功率耗散（最大）： | 200mW |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 28-SOIC（0.295"，7.50mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 28-SOIC W |
| 包裝： | 管件 |
| 輸出數(shù)目和類型： | 2 電流，單極 |
| 采樣率（每秒）： | 130M |
11
FN4654.7
February 6, 2008
HI5860
Thin Shrink Small Outline Plastic Packages (TSSOP)
α
INDEX
AREA
E1
D
N
12
3
-B-
0.10(0.004)
C A
M
BS
e
-A-
b
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
c
E
0.25(0.010)
B
M
L
0.25
0.010
GAUGE
PLANE
A2
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AE, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
0.05(0.002)
M28.173
28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.047
-
1.20
-
A1
0.002
0.006
0.05
0.15
-
A2
0.031
0.051
0.80
1.05
-
b
0.0075
0.0118
0.19
0.30
9
c
0.0035
0.0079
0.09
0.20
-
D
0.378
0.386
9.60
9.80
3
E1
0.169
0.177
4.30
4.50
4
e
0.026 BSC
0.65 BSC
-
E
0.246
0.256
6.25
6.50
-
L
0.0177
0.0295
0.45
0.75
6
N28
28
7
α
0o
8o
0o
8o
-
Rev. 0 6/98
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HI5760/6IB | IC DAC 10-BIT 60MSPS 28-SOIC |
| HI5760BIB | IC DAC 10-BIT 125MSPS 28-SOIC |
| HI5741BIB | IC DAC 14-BIT 100MSPS 28-SOIC |
| VE-222-IW-S | CONVERTER MOD DC/DC 15V 100W |
| VE-B62-MX-F2 | CONVERTER MOD DC/DC 15V 75W |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HI5960IBZ | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 14-BIT D/A 125MSPS 2 8LD IND TEMP RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| HI5960SOICEVAL1 | 功能描述:數(shù)據(jù)轉(zhuǎn)換 IC 開發(fā)工具 HI5960 EVAL PL ATFORM PKG RoHS:否 制造商:Texas Instruments 產(chǎn)品:Demonstration Kits 類型:ADC 工具用于評(píng)估:ADS130E08 接口類型:SPI 工作電源電壓:- 6 V to + 6 V |
| HI5E | 制造商:HUBBELL 功能描述:JACK, HI-IMPACT,5E,UNI,YL |
| HI5E30AA | 制造商:Hubbell Premise Wiring 功能描述: |
| HI5EC | 制造商:Hubbell Wiring Device-Kellems 功能描述:JACK, IN-LINE COUPLER,HI,5E,WH |
發(fā)布緊急采購，3分鐘左右您將得到回復(fù)。