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參數(shù)資料
| 型號(hào)： | HI5960IA |
| 廠商： | Intersil |
| 文件頁數(shù)： | 6/12頁 |
| 文件大小： | 0K |
| 描述： | CONV D/A 14BIT 130MSPS 28-TSSOP |
| 標(biāo)準(zhǔn)包裝： | 50 |
| 設(shè)置時(shí)間： | 35ns |
| 位數(shù)： | 14 |
| 數(shù)據(jù)接口： | 并聯(lián) |
| 轉(zhuǎn)換器數(shù)目： | 1 |
| 電壓電源： | 模擬和數(shù)字 |
| 功率耗散（最大）： | 200mW |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 28-TSSOP（0.173"，4.40mm 寬） |
| 供應(yīng)商設(shè)備封裝： | 28-TSSOP |
| 包裝： | 管件 |
| 輸出數(shù)目和類型： | 2 電流，單極 |
| 采樣率（每秒）： | 130M |
3
Pin Descriptions
PIN NO.
PIN NAME
DESCRIPTION
1-14
D13 (MSB) Through
D0 (LSB)
Digital Data Bit 13, (Most Significant Bit) through Digital Data Bit 0, (Least Significant Bit).
15
SLEEP
Control Pin for Power-Down mode. Sleep Mode is active high; Connect to ground for Normal Mode. Sleep
pin has internal 20
A active pulldown current.
16
REFLO
Connect to analog ground to enable internal 1.2V reference or connect to AVDD to disable internal
reference.
17
REFIO
Reference voltage input if internal reference is disabled. Reference voltage output if internal reference is
enabled. Use 0.
1F cap to ground when internal reference is enabled.
18
FSADJ
Full Scale Current Adjust. Use a resistor to ground to adjust full scale output current. Full Scale Output
Current = 32 x VFSADJ/RSET.
19
COMP1
For use in reducing bandwidth/noise. Recommended: connect 0.1
F to AVDD.
21
IOUTB
The complimentary current output of the device. Full scale output current is achieved when all input bits
are set to binary 0.
22
IOUTA
Current output of the device. Full scale output current is achieved when all input bits are set to binary 1.
23
COMP2
Connect 0.1
F capacitor to ACOM.
24
AVDD
Analog Supply (+3V to +5V).
20, 25
ACOM
Connect to Analog Ground.
26
DCOM
Connect to Digital Ground.
27
DVDD
Digital Supply (+3V to +5V).
28
CLK
Clock Input. Input data to the DAC passes through the “master” latches when the clock is low and is
latched into the “master” latches when the clock is high. Data presented to the “slave” latch passes
through when the clock is logic high and is latched into the “slave” latches when the clock is logic low.
Adequate setup time must be allowed for the MSBs to pass through the thermometer decoder before the
clock goes high. This master-slave arrangement comprises an edge-triggered flip-flop, with the DAC
being updated on the rising clock edge. It is recommended that the clock edge be skewed such that setup
time is larger than the hold time.
HI5960
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| HI5960IA-T | 功能描述:CONV D/A 14BIT 130MSPS 28-TSSOP RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時(shí)間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:* |
| HI5960IAZ | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 28 -40 85C 14 BIT 125MSPS CMOS DAC RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| HI5960IAZ-T | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 28 -40 85C 14 BIT 125MSPS CMOS DACPE RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| HI5960IB | 功能描述:IC DAC 14-BIT 130MSPS 28-SOIC RoHS:否 類別:集成電路 (IC) >> 數(shù)據(jù)采集 - 數(shù)模轉(zhuǎn)換器 系列:- 標(biāo)準(zhǔn)包裝:2,400 系列:- 設(shè)置時(shí)間:- 位數(shù):18 數(shù)據(jù)接口:串行 轉(zhuǎn)換器數(shù)目:3 電壓電源:模擬和數(shù)字 功率耗散（最大）:- 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:36-TFBGA 供應(yīng)商設(shè)備封裝:36-TFBGA 包裝:帶卷 (TR) 輸出數(shù)目和類型:* 采樣率（每秒）:* |
| HI5960IBZ | 功能描述:數(shù)模轉(zhuǎn)換器- DAC 14-BIT D/A 125MSPS 2 8LD IND TEMP RoHS:否 制造商:Texas Instruments 轉(zhuǎn)換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉(zhuǎn)換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時(shí)間:1 us 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
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