參數(shù)資料
| 型號： | HI5860IBZ |
| 廠商： | Intersil |
| 文件頁數(shù)： | 3/12頁 |
| 文件大?。?/td> | 0K |
| 描述： | CONV D/A 12-BIT 130MSPS 28-SOIC |
| 標準包裝： | 26 |
| 設置時間： | 35ns |
| 位數(shù)： | 12 |
| 數(shù)據(jù)接口： | 并聯(lián) |
| 轉換器數(shù)目： | 1 |
| 電壓電源： | 模擬和數(shù)字 |
| 功率耗散（最大）： | 200mW |
| 工作溫度： | -40°C ~ 85°C |
| 安裝類型： | 表面貼裝 |
| 封裝/外殼： | 28-SOIC（0.295"，7.50mm 寬） |
| 供應商設備封裝： | 28-SOIC W |
| 包裝： | 管件 |
| 輸出數(shù)目和類型： | 2 電流，單極 |
| 采樣率（每秒）： | 130M |
11
FN4654.7
February 6, 2008
HI5860
Thin Shrink Small Outline Plastic Packages (TSSOP)
α
INDEX
AREA
E1
D
N
12
3
-B-
0.10(0.004)
C A
M
BS
e
-A-
b
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
c
E
0.25(0.010)
B
M
L
0.25
0.010
GAUGE
PLANE
A2
NOTES:
1. These package dimensions are within allowable dimensions of
JEDEC MO-153-AE, Issue E.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm
(0.006 inch) per side.
4. Dimension “E1” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.15mm (0.006 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “b” does not include dambar protrusion. Allowable dambar
protrusion shall be 0.08mm (0.003 inch) total in excess of “b” dimen-
sion at maximum material condition. Minimum space between protru-
sion and adjacent lead is 0.07mm (0.0027 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact. (Angles in degrees)
0.05(0.002)
M28.173
28 LEAD THIN SHRINK SMALL OUTLINE PLASTIC
PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.047
-
1.20
-
A1
0.002
0.006
0.05
0.15
-
A2
0.031
0.051
0.80
1.05
-
b
0.0075
0.0118
0.19
0.30
9
c
0.0035
0.0079
0.09
0.20
-
D
0.378
0.386
9.60
9.80
3
E1
0.169
0.177
4.30
4.50
4
e
0.026 BSC
0.65 BSC
-
E
0.246
0.256
6.25
6.50
-
L
0.0177
0.0295
0.45
0.75
6
N28
28
7
α
0o
8o
0o
8o
-
Rev. 0 6/98
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| HI5860IBZ-T | 功能描述:數(shù)模轉換器- DAC 12-BIT D/A 130MSPS 2 8LD IND TEMP RoHS:否 制造商:Texas Instruments 轉換器數(shù)量:1 DAC 輸出端數(shù)量:1 轉換速率:2 MSPs 分辨率:16 bit 接口類型:QSPI, SPI, Serial (3-Wire, Microwire) 穩(wěn)定時間:1 us 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:SOIC-14 封裝:Tube |
| HI5860S0ICEVALI | 制造商:Harris Corporation 功能描述: |
| HI5860SOICEVAL1 | 功能描述:數(shù)據(jù)轉換 IC 開發(fā)工具 HI5860 EVAL PL ATFORM PKG RoHS:否 制造商:Texas Instruments 產品:Demonstration Kits 類型:ADC 工具用于評估:ADS130E08 接口類型:SPI 工作電源電壓:- 6 V to + 6 V |
| HI5865 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:12-Bit, 65 MSPS A/D Converter |
| HI5865EVAL1 | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:12-Bit, 65 MSPS A/D Converter |
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