參數(shù)資料
型號: HI5731BIP
廠商: Intersil
文件頁數(shù): 8/17頁
文件大?。?/td> 0K
描述: IC DAC 12BIT 100MSPS HS 28-PDIP
標準包裝: 13
設置時間: 20ns
位數(shù): 12
數(shù)據(jù)接口: 并聯(lián)
轉換器數(shù)目: 1
電壓電源: 模擬和數(shù)字,雙 ±
功率耗散(最大): 650mW
工作溫度: -40°C ~ 85°C
安裝類型: 通孔
封裝/外殼: 28-DIP(0.600",15.24mm)
供應商設備封裝: 28-PDIP
包裝: 管件
輸出數(shù)目和類型: 2 電流,單極
采樣率(每秒): 100M
16
HI5731
Dual-In-Line Plastic Packages (PDIP)
NOTES:
1. Controlling Dimensions: INCH. In case of conflict between English and
Metric dimensions, the inch dimensions control.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication No. 95.
4. Dimensions A, A1 and L are measured with the package seated in
JEDEC seating plane gauge GS-3.
5. D, D1, and E1 dimensions do not include mold flash or protrusions.
Mold flash or protrusions shall not exceed 0.010 inch (0.25mm).
6. E and
are measured with the leads constrained to be perpendic-
ular to datum
.
7. eB and eC are measured at the lead tips with the leads unconstrained.
eC must be zero or greater.
8. B1 maximum dimensions do not include dambar protrusions. Dambar
protrusions shall not exceed 0.010 inch (0.25mm).
9. N is the maximum number of terminal positions.
10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3,
E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm).
eA
-C-
C
L
E
eA
C
eB
eC
-B-
E1
INDEX
12 3
N/2
N
AREA
SEATING
BASE
PLANE
-C-
D1
B1
B
e
D
D1
A
A2
L
A1
-A-
0.010 (0.25)
C
A
M
BS
E28.6 (JEDEC MS-011-AB ISSUE B)
28 LEAD DUAL-IN-LINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.250
-
6.35
4
A1
0.015
-
0.39
-
4
A2
0.125
0.195
3.18
4.95
-
B
0.014
0.022
0.356
0.558
-
B1
0.030
0.070
0.77
1.77
8
C
0.008
0.015
0.204
0.381
-
D
1.380
1.565
35.1
39.7
5
D1
0.005
-
0.13
-
5
E
0.600
0.625
15.24
15.87
6
E1
0.485
0.580
12.32
14.73
5
e
0.100 BSC
2.54 BSC
-
eA
0.600 BSC
15.24 BSC
6
eB
-
0.700
-
17.78
7
L
0.115
0.200
2.93
5.08
4
N28
28
9
Rev. 1 12/00
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