參數(shù)資料
| 型號： | HI1-574AKD-5 |
| 廠商： | Intersil |
| 文件頁數(shù)： | 9/18頁 |
| 文件大?。?/td> | 0K |
| 描述： | IC ADC 12BIT 40KSPS 1CH 28-SBDIP |
| 標準包裝： | 78 |
| 位數(shù)： | 12 |
| 采樣率（每秒）： | 40k |
| 數(shù)據(jù)接口： | 并聯(lián) |
| 轉換器數(shù)目： | 1 |
| 功率耗散（最大）： | 720mW |
| 電壓電源： | 雙 ± |
| 工作溫度： | 0°C ~ 75°C |
| 安裝類型： | 通孔 |
| 封裝/外殼： | 28-CDIP（0.600"，15.24mm） |
| 供應商設備封裝： | 28-CDIP |
| 包裝： | 管件 |
| 輸入數(shù)目和類型： | 2 個單端，單極；2 個單端，雙極 |
17
FN3096.6
August 7, 2008
HI-574A, HI-674A
Ceramic Dual-In-Line Metal Seal Packages (SBDIP)
NOTES:
1. Index area: A notch or a pin one identification mark shall be locat-
ed adjacent to pin one and shall be located within the shaded
area shown. The manufacturer’s identification shall not be used
as a pin one identification mark.
2. The maximum limits of lead dimensions b and c or M shall be
measured at the centroid of the finished lead surfaces, when
solder dip or tin plate lead finish is applied.
3. Dimensions b1 and c1 apply to lead base metal only. Dimension
M applies to lead plating and finish thickness.
4. Corner leads (1, N, N/2, and N/2+1) may be configured with a
partial lead paddle. For this configuration dimension b3 replaces
dimension b2.
5. Dimension Q shall be measured from the seating plane to the
base plane.
6. Measure dimension S1 at all four corners.
7. Measure dimension S2 from the top of the ceramic body to the
nearest metallization or lead.
8. N is the maximum number of terminal positions.
9. Braze fillets shall be concave.
10. Dimensioning and tolerancing per ANSI Y14.5M - 1982.
11. Controlling dimension: INCH.
bbb
C A - B
S
c
Q
L
A
SEATING
BASE
D
PLANE
S
-D-
-A-
-C-
eA
-B-
aaa
CA - B
M
D
S
ccc
CA - B
M
D
S
D
E
S1
b2
b
A
e
M
c1
b1
(c)
(b)
SECTION A-A
BASE
LEAD FINISH
METAL
eA/2
S2
M
A
D28.6 MIL-STD-1835 CDIP2-T28 (D-10, CONFIGURATION C)
28 LEAD CERAMIC DUAL-IN-LINE METAL SEAL PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
-
0.232
-
5.92
-
b
0.014
0.026
0.36
0.66
2
b1
0.014
0.023
0.36
0.58
3
b2
0.045
0.065
1.14
1.65
-
b3
0.023
0.045
0.58
1.14
4
c
0.008
0.018
0.20
0.46
2
c1
0.008
0.015
0.20
0.38
3
D
-
1.490
-
37.85
-
E
0.500
0.610
12.70
15.49
-
e
0.100 BSC
2.54 BSC
-
eA
0.600 BSC
15.24 BSC
-
eA/2
0.300 BSC
7.62 BSC
-
L
0.125
0.200
3.18
5.08
-
Q
0.015
0.060
0.38
1.52
5
S1
0.005
-
0.13
-
6
S2
0.005
-
0.13
-
7
α
90o
105o
90o
105o
-
aaa
-
0.015
-
0.38
-
bbb
-
0.030
-
0.76
-
ccc
-
0.010
-
0.25
-
M
-
0.0015
-
0.038
2
N28
28
8
Rev. 0 5/18/94
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| HI1-574AKDB3924-0003 | 制造商:Rochester Electronics LLC 功能描述:- Bulk 制造商:Harris Corporation 功能描述: |
| HI1-574ALD5 | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:Converter IC |
| HI1-574ALD-5 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HI1-574ASAD/883 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HI1-574ASD/883 | 制造商:Rochester Electronics LLC 功能描述:ADC 12BIT 50KSPS 28SBDIP /883 - Bulk |
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