
HI-8010/HI-8110 Series
ORDERING INFORMATION
PACKAGE
DESCRIPTION
#
LEADS
PLASTIC DUAL-IN-LINE (PDIP)
40
48
PLASTIC QUAD FLAT PACK (PQFP)
52
PLASTIC J-LEAD CHIP CARRIER (PLCC)
44
CERAMIC DUAL-IN-LINE (CDIP)
40
48
CERAMIC LEADLESS CHIP CARRIER (LCC)
40
48
CERAMIC J-LEAD CHIP CARRIER
44
48
CERAMIC LEADED CHIP CARRIER
40
48
SEMI-CUSTOM PACKAGING
The above part numbers represent some of the typical configurations of the HI-8010 & HI-8110 products. They can also be provided
with a varied number of output segments (30, 32 and 38), with either industrial or military screening and in a wide variety of packages.
Listed below are currently available packages. Please contact the Holt Sales Department for your specific requirements.
PART
NUMBER
TTL Logic Inputs
NUMBER OF
SEGMENTS
MASTER PACKAGE
/SLAVE
DESCRIPTION
TEMPERATURE
RANGE
BURN
IN
LEAD
FINISH
FLOW
HI-8010J-85
HI-8010PQI
HI-8010PQT
HI-8010SM-32
HI-8010SM-36
32
38
38
38
30
BOTH
BOTH
BOTH
BOTH
BOTH
44 PIN PLASTIC J LEAD
52 PIN PLASTIC QUAD FLAT PACK (PQFP)
52 PIN PLASTIC QUAD FLAT PACK (PQFP)
48 PIN CERAMIC LEADLESS CHIP CARRIER -55°C TO +125°C
40 PIN CERAMIC LEADLESS CHIP CARRIER -55°C TO +125°C
-40°C TO +85°C
-40°C TO +85°C
-55°C TO +125°C
I
I
NO
NO
NO
YES SOLDER
YES SOLDER
SOLDER
SOLDER
SOLDER
T
M
M
CMOS Logic Inputs
HI-8110J-85
HI-8110PQI
HI-8110PQT
HI-8110SM-32
HI-8110SM-36
32
38
38
38
30
BOTH
BOTH
BOTH
BOTH
BOTH
44 PIN PLASTIC J LEAD
52 PIN PLASTIC QUAD FLAT PACK (PQFP)
52 PIN PLASTIC QUAD FLAT PACK (PQFP)
48 PIN CERAMIC LEADLESS CHIP CARRIER -55°C TO +125°C
40 PIN CERAMIC LEADLESS CHIP CARRIER -55°C TO +125°C
-40°C TO +85°C
-40°C TO +85°C
-55°C TO +125°C
I
I
NO
NO
NO
YES SOLDER
YES SOLDER
SOLDER
SOLDER
SOLDER
T
M
M
HOLT INTEGRATED CIRCUITS
3-7