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T
A
=25°C
T
A
=85°C T
A
=125°C
HI-1565CDI / T / M
HI-1566CDI / T / M
HI-1565PCI / T
HI-1566PCI / T
Data taken at VDD=5.0V, continuous transmission at 1Mbit/s, single transmitter enabled.
62°C
122°C
PACKAGE STYLE
CONDITION
JA
54°C/W
JUNCTION TEMPERATURE
162°C
HI-1565PSI / T / M
HI-1566PSI / T / M
Heat sink
unsoldered
Heat sink
soldered
157°C
117°C
57°C
PART NUMBER
129°C
169°C
47°C/W
44-pin Plastic chip-
scale package
Heat sink
unsoldered
49°C/W
59°C
119°C
159°C
20-pin Thermally
enhanced plastic
SOIC (ESOIC)
20-pin Ceramic
side-brazed DIP
Socketed
62°C/W
69°C
TXA/B
TXA/B
TXINHA/B
TRANSMITTER
BUSA/B
BUSA/B
52.5
(.75 Zo)
52.5
(.75 Zo)
1.79:1
1:1.79
1:1.4
1.4:1
35
(.5 Zo)
Figure 3. Transformer Coupled Test Circuits
HI-1565, HI-1566
THERMAL CHARACTERISTICS
Coupling
Transformer
Coupling
Transformer
Isolation
Transformer
Isolation
Transformer
RECEIVER
52.5
(.75 Zo)
52.5
(.75 Zo)
35
(.5 Zo)
RXA/B
RXA/B
RXENA/B
Point
“A ”
T
Point
“A ”
T
Both the HI-1565PSI/T/M and HI-1566PSI/T/M use a
20-pin thermally enhanced SOIC package. The
HI-1565PCI/T and HI-1566PCI/T use a plastic chip-scale
package. These packages include a metal heat sink
located on the bottom surface of the device. This heat
sink should be soldered down to the printed circuit board
for optimum thermal dissipation.
electrically isolated and may be soldered to any
convenient power or ground plane..
The heat sink is
HEAT SINK - ESOIC & CHIP-SCALE PACKAGE
HOLT INTEGRATED CIRCUITS
6
APPLICATIONS NOTE
Holt Applications Note AN-500 provides circuit design
notes regarding the use of Holt's family of MIL-STD-1553
transceivers. Layout considerations, as well as
recommended interface and protection components are
included.