參數(shù)資料
型號: HFBR24E4M
英文描述: Low Cost, Miniature Fiber Optic Components with ST, SMA, SC and FC Ports
中文描述: 低成本,微型光纖器件與ST,形狀記憶合金,SC和FC端口
文件頁數(shù): 27/31頁
文件大?。?/td> 657K
代理商: HFBR24E4M
72
Reliability Information
Low Cost Miniature Link
components with the Conductive
Port Option are as reliable as
standard HFBR-0400
components. The following tests
were performed to verify the
mechanical reliability of this
option.
Ordering Information
To order the Conductive Port
Option with a particular receiver
component, place a “C” after the
base part number. For example,
to order an HFBR-2406 with this
option, order an HFBR-2406C. As
another example, to order an
HFBR-2416T with this option,
order an HFBR-2416TC.
This option is available with the
following part numbers:
HFBR-2402
HFBR-2404
HFBR-2406
HFBR-2412T
HFBR-2414T
HFBR-2416T
HFBR-2432
HFBR-2434
HFBR-2436
HFBR-2442T
HFBR-2444T
HFBR-2446T
HFBR-2452
HFBR-2454
HFBR-2456
HFBR-2462T
HFBR-2464T
HFBR-2466T
MIL-STD-883/
Other
Reference
1010
Condition B
Units
Tested
70
Total
Failed
0
Test
Test Conditions
Temperature Cycling
-55
°
C to +125
°
C
15 min. dwell/5 min. transfer
100 cycles
-55
°
C to +125
°
C
5 min. dwell/10 sec. transfer
500 cycles
T
A
= 125
°
C
1000 hours
1500 g/0.5 ms
5 impacts each axis
6 Kg-cm no port damage
45 psi, 10 hours
No leakage into microelectronic cavity
245
°
C
3 one min. immersion brush
after solvent
5 minutes in Acetone, Methanol,
Boiling Water
T
A
= 85
°
C, RH = 85%
Biased, 500 hours
8 oz. wt. to each lead tested for
three 90
°
arcs of the case
Direct contact discharge to port,
0-15 kV
Thermal Shock
1011
45
0
Condition B
High temp. Storage
1008
50
0
Condition B
2002
Condition B
T
A
= 25
°
C
1014
Condition D
2003
2015
Mechanical Shock
40
0
Port Strength
Seal Dye Penetrant
(Zyglo)
Solderability
Resistance to
Solvents
Chemical Resistance
20
15
0
0
10
13`
0
0
-
12
0
Temperature-
Humidity
Lead Integrity
-
30
0
2004
16
0
Condition B2
IEC-801-2
Electrostatic
Discharge (ESD)
16
0
Mechanical and Environmental Tests
[1]
[2]
[3]
Notes:
Tests were performed on both SMA an ST products with the conductive port option.
The Port Strength test was designed to address the concerns with hand tightening the SMA connector to the fiber optic port. The limit
is set to a level beyond most reasonable hand fastening loading.
HP has previously used an air discharge method to measure ESD; results using this method vary with air temperature and humidity.
The direct contact discharge method is perferred due to better repeatability and conformance with IEC procedures. ESD immunity
measured with the air discharge method is generally higher than with the direct contact discharge method.
1.
2.
3.
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