參數(shù)資料
型號: HFBR-1116T
英文描述: Fiber Optic Transmitter Data Links for 155 MBd(應(yīng)用于155 MBd的光纖傳送數(shù)據(jù)鏈路)
中文描述: 光纖發(fā)射數(shù)據(jù)鏈接為155 MBd的(應(yīng)用于155 MBd的的光纖傳送數(shù)據(jù)鏈路)
文件頁數(shù): 4/12頁
文件大小: 212K
代理商: HFBR-1116T
4
Transmitter and Receiver
Signaling Rate Range and
BER Performance
For purposes of definition, the
symbol rate (Baud), also called
signaling rate, is the reciprocal of
the symbol time. Data rate (bits/
sec) is the symbol rate divided by
the encoding factor used to encode
the data (symbols/bit).
When used in 115 Mbps SONET
OC-3 applications, the perform-
ance of Hewlett-Packard’s
1300 nm data link modules, HFBR-
1116/-2116, is guaranteed to the
full conditions listed in the individ-
ual product specification tables.
The data link modules may be used
for other applications at signaling
rates different than the 155 Mbps
with some variation in the link
optical power budget. Figure 5
gives an indication of the typical
performance of these 1300 nm
products at different rates.
These data link modules can also
be used for applications which
require different bit-error-ratio
(BER) performance. Figure 6
illustrates the typical trade-off
between link BER and the receiver
input optical power level.
The jitter specifications stated in
the following transmitter and
receiver specification table are
derived from the values in Table
B1 of Annex B. They represent the
worst-case jitter contribution that
the transmitter and receiver are
allowed to make to the overall
system jitter without violating the
Annex B allocation example. In
practice, the typical jitter
contribution of the Agilent data
link modules is well below the
maximum allowed amounts.
Recommended Handling
Precautions
It is advised that normal static pre-
cautions be taken in the handling
and assembly of these data link
modules to prevent damage which
may be induced by electrostatic
discharge (ESD). The HFBR-1116/-
2116 series meets MIL-STD-883C
Method 3015.4 Class 2.
Care should be taken to avoid
shorting the receiver Data or
Signal Detect Outputs directly to
ground without proper current-
limiting impedance.
Solder and Wash Process
Compatibility
The transmitter and receiver are
delivered with protective process
caps covering the individual ST*
ports. These process caps protect
the optical subassemblies during
wave solder and aqueous wash
processing and act as dust covers
during shipping.
These data link modules are
compatible with either industry
standard wave- or hand-solder
processes.
Figure 5. Transmitter/Receiver
Relative Optical Power Budget at
Constant BER vs. Signaling Rate.
T
P
0
200
0
SIGNAL RATE (MBd)
25
75
100 125
2.5
2.0
1.5
1.0
175
0.5
50
150
CONDITIONS:
1. PRBS 2
7
-1
2. DATA SAMPLED AT CENTER OF DATA SYMBOL.
3. BER = 10
-6
4. T
A
= 25° C
5. V
= 5 Vdc
6. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
0.5
Figure 6. Bit Error Ratio vs. Relative
Receiver Input Optical Power.
B
-6
4
1 x 10
-2
RELATIVE INPUT OPTICAL POWER – dB
-4
2
-2
0
1 x 10
-4
1 x 10
-6
1 x 10
-7
1 x 10
-8
1 x 10
-9
1 x 10
-10
1 x 10
-11
1 x 10
-12
CONDITIONS:
1. 155 MBd
2. PRBS 2
7
-1
3. T
A
= 25° C
4. V
CC
= 5 Vdc
5. INPUT OPTICAL RISE/FALL TIMES = 1.0/2.1 ns.
1 x 10
-5
1 x 10
-3
CENTER OF SYMBOL
Data Link Jitter
Performance
The Agilent 1300 nm data link
modules are designed to operate
per the system jitter allocations
stated in Table B1 of Annex B of
the ANSI T1E1.2 Revision 3
standard.
The 1300 nm transmitter will
tolerate the worst-case input
electrical jitter allowed in Annex B
without violating the worst-case
output jitter requirements.
The 1300 nm receiver will tolerate
the worst-case input optical jitter
allowed in Annex B without
violating the worst-case output
electrical jitter allowed.
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