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參數(shù)資料
| 型號(hào)： | HFA3667IA |
| 廠商： | INTERSIL CORP |
| 元件分類： | 無繩電話/電話 |
| 英文描述： | CDMA/AMPS, UpConverter with Gain Control |
| 中文描述： | TELECOM, CELLULAR, RF AND BASEBAND CIRCUIT, PDSO28 |
| 封裝： | PLASTIC, SSOP-28 |
| 文件頁數(shù)： | 6/6頁 |
| 文件大?。?/td> | 189K |
| 代理商： | HFA3667IA |
6
HFA3667
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. Dimension “B” does not include dambar protrusion. Allowable
dambar protrusion shall be 0.10mm (0.004 inch) total in excess
of “B” dimension at maximum material condition.
10. Controlling dimension: INCHES. Converted millimeter dimen-
sions are not necessarily exact.
α
INDEX
AREA
E
D
N
1
2
3
-B-
0.17(0.007)
C A
M
B S
e
-A-
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45
o
C
H
0.25(0.010)
B
M
M
L
0.25
0.010
GAUGE
PLANE
A2
Shrink Small Outline Plastic Packages (SSOP)
M28.15
28 LEAD SHRINK NARROW BODY SMALL OUTLINE
PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.053
0.069
1.35
1.75
-
A1
0.004
0.010
0.10
0.25
-
A2
-
0.061
-
1.54
-
B
0.008
0.012
0.20
0.30
9
C
0.007
0.010
0.18
0.25
-
D
0.386
0.394
9.81
10.00
3
E
0.150
0.157
3.81
3.98
4
e
0.025 BSC
0.635 BSC
-
H
0.228
0.244
5.80
6.19
-
h
0.0099
0.0196
0.26
0.49
5
L
0.016
0.050
0.41
1.27
6
N
α
28
28
7
0
o
8
o
0
o
8
o
-
Rev. 0 2/95
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