
2-9
Absolute Maximum Ratings
Thermal Information
Supply Voltage, V
DD
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +10V
DC
Input Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . +17dBm
Supply Current (Note 1). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30mA
Operating Conditions
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . . -40
o
C to 85
o
C
Thermal Resistance (Typical, Note 2)
SOIC Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Maximum Storage Temperature Range. . . . . . . . . . -65
o
C to 150
o
C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .300
o
C
(SOIC - Lead Tips Only)
θ
JA
(
o
C/W)
165
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
1. Only if Pin 2 is used to increase current.
2.
θ
JA
is measured with the component mounted on an evaluation PC board in free air.
Electrical Specifications
T
A
= 25
o
C, Z
0
= 50
, V
DD
= +5V, P
IN
= -30dBm, f = 2.45GHz, V
BIAS
= Open Circuit
Unless Otherwise Specified
PARAMETER
MIN
TYP
MAX
UNITS
LNA Input Frequency Range
2.4
-
2.5
GHz
Gain
12
14
16
dB
Noise Figure
-
1.90
2.30
dB
Input VSWR
-
1.5:1
-
Output VSWR
-
1.5:1
-
Input Return Loss
-
-14.0
-
dB
Output Return Loss
-
-14.0
-
dB
Output 1dB Compression
-
3
-
dBm
Input IP
3
-
1
-
dBm
Reverse Isolation
-
30
-
dB
Supply Current at V
DD
= 5V
3
5
7
mA
Supply Range
2.7
-
5.5
V
Typical Performance Curves
FIGURE 2. GAIN vs FREQUENCY
FIGURE 3. NOISE FIGURE vs FREQUENCY
T
A
= 25
o
C
3V, 5mA
5V, 20mA
5V, 5mA
2.2
2.3
2.4
2.5
2.6
2.7
18
16
14
12
10
FREQUENCY (GHz)
G
T
A
= 25
o
C
3V, 5mA
5V, 20mA
5V, 5mA
2.40
2.42
2.44
FREQUENCY (GHz)
2.46
2.48
2.50
2.0
1.9
1.8
1.7
1.6
N
HFA3424