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參數(shù)資料
| 型號： | HF30A060ACE |
| 文件頁數(shù)： | 1/1頁 |
| 文件大小： | 15K |
| 代理商： | HF30A060ACE |
HF30A060ACE
Preliminary Data Sheet PD-20608 rev.A 11/98
Hexfred Die in Wafer Form
600 V
Size 30
5" Wafer
Nominal Back Metal Composition, Thickness
Nominal Front Metal Composition, Thickness
Chip Dimensions
Wafer Diameter
Wafer Thickness
Relevant Die Mechanical Dwg. Number
Minimum Street Width
Reject Ink Dot Size
Recommended Storage Environment
Cr-Ni-Ag ( 1kA-4kA-6kA )
99% Al, 1% Si (3 microns)
0.115" x 0.155"
125mm, with std. < 100 > flat
.015" ± .003"
01-5161
100 Microns
0.25mm Diameter Minimum
Store in original container, in dessicated
nitrogen, with no contamination
Mechanical Data
Die Outline
Reference Standard IR packaged part ( for design ) : HFA15TB60
Parameter
V
FM
BV
R
I
RM
Description
Guaranteed (Min/Max)
1.7V Max.
600V Min.
10μA Max.
Test Conditions
Forward Voltage
Reverse Breakdown Voltage
Reverse Leakage Current
T
J
= 25°C, I
F
= 15.0A
T
J
= 25°C, I
R
= 200μA
T
J
= 25°C, V
R
= 600V
Electrical Characteristics ( Wafer Form )
NOTES :
1. ALL DIMENSIONS ARE SHOWN IN MILLIMETERS ( INCHES )
2. CONTROLLING DIMENSION : ( INCH )
3. DIMENSIONAL TOLERANCES :
BONDING PADS : < 0.635 TOLERANCE = ± 0.013
WIDTH
< (.0250) TOLERANCE = ± (.0005)
&
> 0.635 TOLERANCE = ± 0.025
LENGTH
> (.0250) TOLERANCE = ± (.0010)
OVERALLDIE
< 1.270 TOLRANCE = ± 0.102
WIDTH
< (.050) TOLERANCE = ± (.004)
&
> 1.270 TOLERANCE = ± 0.203
LENGTH
> (.050) TOLERANCE = ± (.008)
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相關代理商/技術參數(shù) |
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|---|---|
| HF30ACB | 制造商:TDK 制造商全稱:TDK Electronics 功能描述:EMC Components |
| HF30ACB201209-T | 功能描述:電磁干擾濾波珠子、扼流圈和陣列 7 OHM 25% FERRITE CORE RoHS:否 制造商:AVX 阻抗: 最大直流電流:35 mA 最大直流電阻: 容差: 端接類型:SMD/SMT 電壓額定值:25 V 工作溫度范圍:- 25 C to + 85 C 封裝 / 箱體:0603 (1608 metric) |
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| HF30ACB321611T | 制造商:n/a 功能描述:* |
| HF30ACB321611-T | 功能描述:電磁干擾濾波珠子、扼流圈和陣列 19ohms 0.2ohms 500mA RoHS:否 制造商:AVX 阻抗: 最大直流電流:35 mA 最大直流電阻: 容差: 端接類型:SMD/SMT 電壓額定值:25 V 工作溫度范圍:- 25 C to + 85 C 封裝 / 箱體:0603 (1608 metric) |
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