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參數(shù)資料
| 型號(hào)： | HDLP11090SFHD-0P0 |
| 廠(chǎng)商： | HYPERTRONICS CORP |
| 元件分類(lèi)： | D-微型連接器 |
| 英文描述： | 90 CONTACT(S), FEMALE, OTHER D TYPE CONNECTOR, SOLDER |
| 文件頁(yè)數(shù)： | 1/6頁(yè) |
| 文件大?。?/td> | 246K |
| 代理商： | HDLP11090SFHD-0P0 |
Dimensions are in inches [mm]
HDLP Series
3 / 21
www.hypertronics.com
High Density Low Profile
Connectors
High density contact arrangement
Light weight Low profile mated height
Surface mount termination technology
Miniature hyperboloid socket contacts
Interfacial seal
Polarized and scoop proof
Pick and place compatible
General Specifications
Insulator Material
Liquid crystal polymer (LCP)
Contact Material
Copper alloy
Socket Wire Material
Beryllium copper
Interfacial Seal Material
Fluorosilicone
Guides Material
Stainless steel
Contact Plating
ASTM-488-B
(Type II, grade C, Class 1)
Contact Resistance
8 milliohms max.
Current Rating
2 Amps per contact
Contact Life Cycles
2,000+ operations
Extraction Forces
1.0 oz.
Temperature Range
-55° C to 125° C
Voltage Rating
110 VDC or AC peak nomial
Contact Diameter
0.015 [0.39]
* PLATING THICKNESS
These values apply to mating surfaces.
Contact Plating Finishes
Connector Finish
Ordering Code
Description
Component
Component Finish
Ordering Code
Conforms To
Plating Thickness*
U
Gold Plate
Socket
-/9
ASTM-488-B
(Type II, Grade C, Class 1)
1.27 m gold plate min.
50 in gold plate min.
Pin
-/7
ASTM-488-B
(Type II, Grade C, Class 1)
1.27 m gold plate min.
50 in gold plate min.
Current Rating
The Hypertac contact design and manufacturing toler-
ances endow the product with the following attributes:
Double the current rating of other contact designs
of similar size
Low contact resistance in high current applications
minimizes temperature rise thereby enabling higher
density interconnects
HYP_08_3rec13.qxd:Layout 1
8/6/08
4:48 PM
Page 21
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