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參數(shù)資料
| 型號： | HDB-M4-120C256T |
| 廠商： | AMPHENOL CORP |
| 元件分類： | 電路板相疊連接器 |
| 英文描述： | 120 CONTACT(S), FEMALE, STRAIGHT TWO PART BOARD CONNECTOR, SOLDER |
| 文件頁數(shù)： | 1/5頁 |
| 文件大小： | 791K |
| 代理商： | HDB-M4-120C256T |
1
Product Data Sheet
Amphenol HDB3 Series High Density
Mother Board & Daughter Board Connectors
No. 201-3
Rectangular Interconnects with
.070” X .060” Grid Spacing
This new connector series incorporates a higher
density contact pattern and lower mated height
than Amphenol’s original Low Mating Force rectan-
gular connectors while utilizing the same durable
and reliable B3 contact.
The B3 brush (bristle brush bunch) contact is
that intermesh to create an electrical connection.
Amphenol
HDB 3 Mother Board
Connector
HDB 3 Daughter Board
Connector
BENEFITS OF THE BRUSH CONTACT
Redundant current paths: 14-70 gas tight points
of contact per mated bunch
Very smooth low friction interface
Low mating forces: 1.5 oz. typical per contact,
70-90% lower than conventional contacts
Long contact life: 100,000 cycles of mating and
unmating without performance degradation
Documented intermittency free performance: No
10 nano-second discontinuities during
50,000,000 cycles of 0.010” displacement
Impervious to fretting
Contact interface meets M55302/166 thru /171
@2009 Amphenol Corporation
Printed in U.S.A.
1/8/2009
HDB3 FEATURES
Polarization:
“D” shaped design
Keying:
Optional keys offer 36 unique
keying combinations
Guide Pins
Optional guide pins provide
additional alignment
Radial Misalignment:
Capable of correcting up to a
.020" initial radial misalign-
ment
Angular Misalignment:
Capable of mating with up to a
2° initial angular misalignment
HDB3 CONNECTOR PERFORMANCE
Durability:
100,000 mating cycles
Insertion/Extraction Force:
1.5 ounce typical per contact
Operating Temperature:
-65° to 150°C
Current Rating:
2 amperes
Hot swap 1 ampere maximum
(load dependent)
Insulation Resistance:
5 gigaohms minimum
Dielectric Withstanding
Voltage:
750 volts, 60 hertz, rms @ Sea
Level 250 volts, 60 hertz,
rms @ 70,000 feet Elevation
Solderability:
MIL-STD-202, Method 208
Salt Fog:
48 Hours IAW MIL-STD-1344,
method 1001, test condition B
Humidity:
IAW MIL-STD-1344, method
1002, type II
Vibration:
4 hours in each of 3 mutually
perpendicular axes IAW MIL-ST
1344, method 2005,
test condition V, letter H
Shock:
1 shock along each of three
mutually perpendicular axes IAW
MIL-STD-1344, method 2004,
test condition G
Data Rate:
Capable of 3.125 Gbps (consult
Amphenol for arrangement)
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