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參數(shù)資料
| 型號(hào)： | HDAF-23-18.0-S-13-2 |
| 廠商： | SAMTEC INC |
| 元件分類： | 電路板相疊連接器 |
| 英文描述： | 299 CONTACT(S), FEMALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT |
| 封裝： | ROHS COMPLIANT |
| 文件頁數(shù)： | 1/1頁 |
| 文件大小： | 891K |
| 代理商： | HDAF-23-18.0-S-13-2 |
HDAF–15–18.0–S–13–2
HDAF–23–08.0–S–13–2
Elevated
stack
heights
of 20mm,
25mm,
30mm
and 35mm
Choice of
Tin-Lead or
Lead-Free
Solder
Charge
Open pin eld for
Single-Ended
or Differential Pair
congurations
299,
195
and
143
pins
Intermateable with
Molex HD Mezz
WWW.SAMTEC.COM
F-209 -1
Mates with:
HDAM
LEAD
STYLE
–08.0
–18.0
A
(10,51)
.414
(20,51)
.807
For complete specications and
recommended PCB layouts see
www.samtec.com?HDAF
Insulator Material:
Black Liquid Crystal Polymer
Contact Material:
Copper Alloy
Current Rating:
2.3A @ 80°C ambient
Operating Temp Range:
-55°C to +125°C
Plating:
Au or Sn over
50" (1,27m) Ni
Contact Resistance:
19 m
Ω max
Working Voltage:
200 VAC
Mated Cycles:
100
RoHS Compliant:
Yes
Processing:
Max Processing Temp:
230°C for 60 seconds, or
260°C for 20 seconds 3x
Lead-Free Solderable:
Yes
No.
of
Pins
Per
Row
x
(2,00)
.0787
+
(11,55)
.455
No.
of
Pins
Per
Row
x
(2,00)
.0787
+
(17,92)
.706
A
(22,50)
.886
(1,20)
.0472
(2,00)
.0787
1A
1M
HDAF
NO. OF PINS
PER ROW
PLATING
OPTION
OTHER
OPTION
LEAD
STYLE
Specify
LEAD
STYLE
from
chart
–P
= Pick &
Place Pad
–S
= 30"
(0,76m)
Gold on
contact area,
Matte Tin
on tails and
weld tabs
SOLDER
TYPE
NO. OF
ROWS
–13
–2
= Lead-Free
Tin Alloy
95.5% Sn/
3.8% Ag/0.7% Cu
Solder Charge
–11, –15, –23
MEZZ
finalinch.com
DIFFERENTIAL
APPLICATIONS
PAIR
COUNT*
ARRAY
44
60
92
11x13
15x13
23x13
(1,20)
.0472
(2,00)
.0787
*2:1 S:G Ratio
HDAM LEAD STYLE
HDAF
LEAD
STYLE
–12.0
20mm
30mm
–08.0
–18.0
–17.0
25mm
35mm
*Processing conditions will
affect mated height.
MATED HEIGHTS*
Note: HD Mezz is a trademark
of Molex Incorporated
Note: Some lengths, styles
and options are non-standard,
non-returnable.
HD MEZZ ELEVATED ARRAY HDAF
SERIES
ALSO
AVAILABLE
Tin-Lead Solder Charge.
Call Samtec.
35mm Stack Height
Rated @ -3dB Insertion Loss*
Single-Ended Signaling
9.0 GHz / 18.0 Gbps
Differential Pair Signaling
9.0 GHz / 18.0 Gbps
*Data based on simulations using Final Inch design.
SPECIFICATIONS
Note: Other Gold plating
options available.
Contact Samtec.
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HDAF-11-08-S-13-1 | 143 CONTACT(S), FEMALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT, SOCKET |
| HDAF-11-08-S-13-2 | 143 CONTACT(S), FEMALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT, SOCKET |
| HDAF-11-18-S-13-1 | 143 CONTACT(S), FEMALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT, SOCKET |
| HDAF-11-18-S-13-2 | 143 CONTACT(S), FEMALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT, SOCKET |
| HDAF-15-08-S-13-1 | 195 CONTACT(S), FEMALE, STRAIGHT BOARD STACKING CONNECTOR, SURFACE MOUNT, SOCKET |
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