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參數資料
| 型號： | HD49323AF-01 |
| 廠商： | Hitachi,Ltd. |
| 元件分類： | 圓形連接器 |
| 英文描述： | Circular Connector; No. of Contacts:100; Series:MS27467; Body Material:Aluminum; Connecting Termination:Crimp; Connector Shell Size:23; Circular Contact Gender:Socket; Circular Shell Style:Straight Plug; Insert Arrangement:23-35 RoHS Compliant: No |
| 中文描述： | 的CDS /自動增益控制 |
| 文件頁數： | 22/27頁 |
| 文件大?。?/td> | 104K |
| 代理商： | HD49323AF-01 |
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HD49323AF-01
22
Notice for Use
1. Careful handling is necessary to prevent damage due to static electricity.
2. This product has been developed for consumer applications, and should not be used in non-consumer
applications.
3. As this IC is sensitive to power line noise, the ground impedance should be kept as small as possible.
Also, to prevent latchup, a ceramic capacitor of 0.1
μ
F or more and an electrolytic capacitor of 10
μ
F or
more should be inserted between the ground and power supply.
4. Common connection of AV
DD
and DV
DD
should be made off-chip. If AV
DD
and DV
DD
are isolated by a
noise filter, the phase difference should be 0.3 V or less at power-on and 0.1 V or less during operation.
5. If a noise filter is necessary, make a common connection after passage through the filter, as shown in
the figure below.
HD49323AF-01
AV
SS
DV
SS
AV
DD
DV
DD
Noise filter
Analog
+3.0V
HD49323AF-01
DV
SS
AV
SS
DV
DD
AV
DD
100
μ
H
0.01
μ
F
Noise filter
Example of noise filter
Digital
+3.0V
0.01
μ
F
6. Connect AV
SS
and DV
SS
off-chip using a common ground. If there are separate analog system and
digital system set grounds, connect to the analog system.
7. When V
DD
is specified in the delivery specification, this indicates AV
DD
and DV
DD
.
8. No Connection (NC) pins are not connected inside the IC, but it is recommended that they be used as
power supply ground pins or left open to prevent crosstalk in adjacent analog pins.
9. To ensure low thermal resistance of the package, a Cu-type lead material is used. As this material is
less tolerant of bending than Fe-type lead material, careful handling is necessary.
10.The infrared reflow soldering method should be used to mount the chip. Note that general heating
methods such as solder dipping cannot be used.
11.Depending on the mounting state, picture quality (crosscut noise, wave pattern, etc.) will be dependent
upon the timing of the SPBLK, SPSIG, and ADCLK signals. Check the mounting state thoroughly
before use.
12.Serial communication should not be performed during the effective video period, since this will result in
degraded picture quality. Also, use of dedicated ports is recommended for the SCK and SDATA
signals used in the HD49323AF-01. If ports are to be shared with another IC, picture quality should
first be thoroughly checked.
13.At power-on, automatic adjustment of the offset voltage generated from CDS, AGC, ADC, etc., must be
implemented in accordance with the power-on operating sequence (see page 24).
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