參數(shù)資料
型號(hào): HCTS365MS
廠商: Intersil Corporation
英文描述: Radiation Hardened Hex Buffer/Line Driver Non-Inverting
中文描述: 輻射硬化六角緩沖器/線路驅(qū)動(dòng)器非反相
文件頁數(shù): 10/10頁
文件大?。?/td> 200K
代理商: HCTS365MS
10
HCTS365MS
Die Characteristics
DIE DIMENSIONS:
108 x 106 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 mils x 4 mils
Metallization Mask Layout
HCTS365MS
OE1
(1)
NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS365 is TA14413A.
A1
(2)
A2 (4)
Y2 (5)
A3 (6)
Y3
(7)
GND
(8)
Y4
(9)
(12) A5
(13) Y6
(14) A6
NC
OE2
(15)
VCC
(16)
(11) Y5
Y1
(3)
NC
NC
NC
A4
(10)
Spec Number
518637
相關(guān)PDF資料
PDF描述
HCTS365HMSR Radiation Hardened Hex Buffer/Line Driver Non-Inverting
HCTS541D Quadruple 2-Input Positive-NOR Gates 14-CDIP -55 to 125
HCTS541MS Radiation Hardened Non-Inverting Octal Buffer/Line Driver, Three-State
HCTS541DMSR Quadruple 2-Input Positive-NOR Gates 14-CFP -55 to 125
HCTS541K Hex Inverters 20-LCCC -55 to 125
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HCTS373D 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal Transparent Latch, Three-State
HCTS373DMSR 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal Transparent Latch, Three-State
HCTS373DTR 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal Transparent Latch, Three-State
HCTS373HMSR 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal Transparent Latch, Three-State
HCTS373K 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal Transparent Latch, Three-State