參數(shù)資料
型號: HCTS365D
廠商: Intersil Corporation
英文描述: Radiation Hardened Hex Buffer/Line Driver Non-Inverting
中文描述: 輻射硬化六角緩沖器/線路驅(qū)動器非反相
文件頁數(shù): 10/10頁
文件大?。?/td> 200K
代理商: HCTS365D
10
HCTS365MS
Die Characteristics
DIE DIMENSIONS:
108 x 106 mils
METALLIZATION:
Type: AlSi
Metal Thickness: 11k
±
1k
GLASSIVATION:
Type: SiO
2
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
<2.0 x 10
5
A/cm
2
BOND PAD SIZE:
100
μ
m x 100
μ
m
4 mils x 4 mils
Metallization Mask Layout
HCTS365MS
OE1
(1)
NOTE: The die diagram is a generic plot form a similar HCS device. It is intended to indicate approximate die size and bond pad location.
The mask series for the HCTS365 is TA14413A.
A1
(2)
A2 (4)
Y2 (5)
A3 (6)
Y3
(7)
GND
(8)
Y4
(9)
(12) A5
(13) Y6
(14) A6
NC
OE2
(15)
VCC
(16)
(11) Y5
Y1
(3)
NC
NC
NC
A4
(10)
Spec Number
518637
相關(guān)PDF資料
PDF描述
HCTS365DMSR Radiation Hardened Hex Buffer/Line Driver Non-Inverting
HCTS365K Radiation Hardened Hex Buffer/Line Driver Non-Inverting
HCTS365KMSR Radiation Hardened Hex Buffer/Line Driver Non-Inverting
HCTS365MS Radiation Hardened Hex Buffer/Line Driver Non-Inverting
HCTS365HMSR Radiation Hardened Hex Buffer/Line Driver Non-Inverting
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
HCTS365DMSR 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Hex Buffer/Line Driver Non-Inverting
HCTS365HMSR 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Hex Buffer/Line Driver Non-Inverting
HCTS365K 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Hex Buffer/Line Driver Non-Inverting
HCTS365KMSR 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Hex Buffer/Line Driver Non-Inverting
HCTS365MS 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Hex Buffer/Line Driver Non-Inverting