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參數(shù)資料
| 型號(hào)： | HCTS245T |
| 廠商： | Intersil Corporation |
| 英文描述： | Radiation Hardened Octal Non-Inverting Bidirectional Bus Transceiver(抗輻射八雙向總線收發(fā)器) |
| 中文描述： | 輻射加固八路非反相雙向總線收發(fā)器（抗輻射八雙向總線收發(fā)器） |
| 文件頁數(shù)： | 3/3頁 |
| 文件大?。?/td> | 93K |
| 代理商： | HCTS245T |
3
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
http://www.intersil.com
Die Characteristics
DIE DIMENSIONS:
(3149
μ
m x 2794
μ
m x 533
μ
m
±
51
μ
m)
124 x 110 x 21mils
±
2mil
METALLIZATION:
Type: Al Si
Thickness: 11.0k
±
1k
SUBSTRATE POTENTIAL:
Unbiased Silicon on Sapphire
BACKSIDE FINISH:
Sapphire
PASSIVATION:
Type: Silox (S
i
O
2
)
Thickness: 13k
±
2.6k
WORST CASE CURRENT DENSITY:
< 2.0e5 A/cm
2
TRANSISTOR COUNT:
274
PROCESS:
CMOS SOS
Metallization Mask Layout
HCTS245T
(18) B0
(17) B1
(16) B2
(15) B3
(14) B4
(13) B5
A0 (2)
A1 (3)
A2 (4)
A3 (5)
A4 (6)
A5 (7)
A
A
G
B
B
N
N
(
(
C
N
N
(
NOTE: The die diagram is a generic plot from a similar HCS device. It is intended to indicate approximate die size and bond pad location. The mask
series for the HCTS245 is TA14417A.
HCTS245T
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| HCTS365D | Radiation Hardened Hex Buffer/Line Driver Non-Inverting |
| HCTS365DMSR | Radiation Hardened Hex Buffer/Line Driver Non-Inverting |
| HCTS365K | Radiation Hardened Hex Buffer/Line Driver Non-Inverting |
| HCTS365KMSR | Radiation Hardened Hex Buffer/Line Driver Non-Inverting |
| HCTS365MS | Radiation Hardened Hex Buffer/Line Driver Non-Inverting |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HCTS273D | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal D Flip-Flop |
| HCTS273DMSR | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal D Flip-Flop |
| HCTS273HMSR | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal D Flip-Flop |
| HCTS273K | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal D Flip-Flop |
| HCTS273KMSR | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal D Flip-Flop |
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