參數(shù)資料
型號: HCS241DMSR
廠商: INTERSIL CORP
元件分類: 通用總線功能
英文描述: Radiation Hardened Inverting Octal Three-State Buffer/Line Driver
中文描述: HC/UH SERIES, DUAL 4-BIT DRIVER, TRUE OUTPUT, CDIP20
封裝: SIDE BRAZED, CERAMIC, DIP-20
文件頁數(shù): 7/9頁
文件大?。?/td> 169K
代理商: HCS241DMSR
308
All Intersil semiconductor products are manufactured, assembled and tested under
ISO9000
quality systems certification.
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate
and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which
may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see web site
http://www.intersil.com
Sales Office Headquarters
NORTH AMERICA
Intersil Corporation
P. O. Box 883, Mail Stop 53-204
Melbourne, FL 32902
TEL: (321) 724-7000
FAX: (321) 724-7240
TEL: (32) 2.724.2111
FAX: (32) 2.724.22.05
EUROPE
Intersil SA
Mercure Center
100, Rue de la Fusee
1130 Brussels, Belgium
ASIA
Intersil (Taiwan) Ltd.
Taiwan Limited
7F-6, No. 101 Fu Hsing North Road
Taipei, Taiwan
Republic of China
TEL: (886) 2 2716 9310
FAX: (886) 2 2715 3029
HCS241MS
Intersil Space Level Product Flow - ‘MS’
Wafer Lot Acceptance (All Lots) Method 5007
(Includes SEM)
GAMMA Radiation Verification (Each Wafer) Method 1019,
4 Samples/Wafer, 0 Rejects
100% Nondestructive Bond Pull, Method 2023
Sample - Wire Bond Pull Monitor, Method 2011
Sample - Die Shear Monitor, Method 2019 or 2027
100% Internal Visual Inspection, Method 2010, Condition A
100% Temperature Cycle, Method 1010, Condition C,
10 Cycles
100% Constant Acceleration, Method 2001, Condition per
Method 5004
100% PIND, Method 2020, Condition A
100% External Visual
100% Serialization
100% Initial Electrical Test (T0)
100% Static Burn-In 1, Condition A or B, 24 hrs. min.,
+125
o
C min., Method 1015
100% Interim Electrical Test 1 (T1)
100% Delta Calculation (T0-T1)
100% Static Burn-In 2, Condition A or B, 24 hrs. min.,
+125
o
C min., Method 1015
100% Interim Electrical Test 2 (T2)
100% Delta Calculation (T0-T2)
100% PDA 1, Method 5004 (Notes 1and 2)
100% Dynamic Burn-In, Condition D, 240 hrs., +125
o
C or
Equivalent, Method 1015
100% Interim Electrical Test 3 (T3)
100% Delta Calculation (T0-T3)
100% PDA 2, Method 5004 (Note 2)
100% Final Electrical Test
100% Fine/Gross Leak, Method 1014
100% Radiographic, Method 2012 (Note 3)
100% External Visual, Method 2009
Sample - Group A, Method 5005 (Note 4)
100% Data Package Generation (Note 5)
NOTES:
1. Failures from Interim electrical test 1 and 2 are combined for determining PDA 1.
2. Failures from subgroup 1, 7, 9 and deltas are used for calculating PDA. The maximum allowable PDA = 5% with no more than 3% of the
failures from subgroup 7.
3. Radiographic (X-Ray) inspection may be performed at any point after serialization as allowed by Method 5004.
4. Alternate Group A testing may be performed as allowed by MIL-STD-883, Method 5005.
5. Data Package Contents:
Cover Sheet (Intersil Name and/or Logo, P.O. Number, Customer Part Number, Lot Date Code, Intersil Part Number, Lot Number, Quan-
tity).
Wafer Lot Acceptance Report (Method 5007). Includes reproductions of SEM photos with percent of step coverage.
GAMMA Radiation Report. Contains Cover page, disposition, Rad Dose, Lot Number, Test Package used, Specification Numbers, Test
equipment, etc. Radiation Read and Record data on file at Intersil.
X-Ray report and film. Includes penetrometer measurements.
Screening, Electrical, and Group A attributes (Screening attributes begin after package seal).
Lot Serial Number Sheet (Good units serial number and lot number).
Variables Data (All Delta operations). Data is identified by serial number. Data header includes lot number and date of test.
The Certificate of Conformance is a part of the shipping invoice and is not part of the Data Book. The Certificate of Conformance is signed
by an authorized Quality Representative.
Spec Number
518838
相關(guān)PDF資料
PDF描述
HCS241K Radiation Hardened Inverting Octal Three-State Buffer/Line Driver
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HCS241HMSR 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Inverting Octal Three-State Buffer/Line Driver
HCS241K 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Inverting Octal Three-State Buffer/Line Driver
HCS241KMSR 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Inverting Octal Three-State Buffer/Line Driver
HCS241MS 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Inverting Octal Three-State Buffer/Line Driver
HCS244D 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Radiation Hardened Octal Buffer/Line Driver, Three-State