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參數(shù)資料
| 型號： | HCPL-675K |
| 英文描述： | Hermetically Sealed, Low IF, Wide VCC, High Gain Optocouplers |
| 中文描述： | 密封，中頻，寬虛擬通道連接，高增益低光耦 |
| 文件頁數(shù)： | 5/12頁 |
| 文件大?。?/td> | 320K |
| 代理商： | HCPL-675K |
5
Hermetic Optocoupler Options
Option
Description
100
200
300
600
Lead finish is solder dipped rather than gold plated. This option is available on commercial and hi-rel
product in 8 and 16 pin DIP. DSCC Drawing part numbers contain provisions for lead finish. All leadless
chip carrier devices are delivered with solder dipped terminals as a standard feature.
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is
available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). Contact
factory for the availability of this option on DSCC part types.
Surface mountable hermetic optocoupler with leads cut and bent for gull wing assembly. This option is
available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details). This
option has solder dipped leads.
Surface mountable hermetic optocoupler with leads trimmed for butt joint assembly. This option is
available on commercial and hi-rel product in 8 and 16 pin DIP (see drawings below for details).
1.14 (0.045)
1.40 (0.055)
4.32 (0.170)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
1.14 (0.045)
1.40 (0.055)
4.32 (0.170)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
7.36 (0.290)
7.87 (0.310)
0.20 (0.008)
0.33 (0.013)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
1.40 (0.055)
1.65 (0.065)
4.57 (0.180)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
0.51 (0.020)
MIN.
3.8MIN.
1.14 (0.045)
1.25 (0.049)
2.29 (0.090)
2.79 (0.110)
0.5MIN.
7.36 (0.290)
0.20 (0.008)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
3.81 (0.150)
MAX.
1.0TYP.
2.29 (0.090)
0.5MIN.
0.51 (0.020)
MIN.
4.57 (0.180)
MAX.
0.51 (0.020)
MAX.
2.29 (0.090)
2.79 (0.110)
1.40 (0.055)
1.65 (0.065)
9.65 (0.380)
9.91 (0.390)
5° MAX.
4.57 (0.180)
MAX.
0.20 (0.008)
0.33 (0.013)
NOTE: DIMENSIONS IN MILLIMETERS (INCHES).
相關PDF資料 |
PDF描述 |
|---|---|
| HCPL-5701-600 | 3.5MM M-M STREO AUDIO 30CBLE; 24AWG, BLCK MOLDED |
| HCPL-7850-100 | Hermetically Sealed Analog Isolation Amplifier |
| HCPL-7850-200 | Hermetically Sealed Analog Isolation Amplifier |
| HCPL-786J-300 | Optically Isolated Sigma-Delta Modulator |
| HCPL-786J-500 | Optically Isolated Sigma-Delta Modulator |
相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| HCPL-7100#300 | 制造商:Hewlett Packard Co 功能描述: |
| HCPL7101300 | 制造商:Hewlett Packard Co 功能描述: |
| HCPL-7510 | 功能描述:隔離放大器 4.5 - 5.5 SV +/-3% RoHS:否 制造商:Texas Instruments 輸入補償電壓:1.5 mV 共模抑制比（最小值）:95 dB 帶寬:60 KHz 工作電源電壓:3.3 V 電源電流:8 mA 工作溫度范圍:- 40 C to + 105 C 安裝風格:SMD/SMT 封裝 / 箱體:SOP-8 封裝:Tube |
| HCPL-7510/EVAL | 制造商:Avago Technologies 功能描述: |
| HCPL-7510-000E | 功能描述:隔離放大器 4.5 - 5.5 SV +/-3% RoHS:否 制造商:Texas Instruments 輸入補償電壓:1.5 mV 共模抑制比（最小值）:95 dB 帶寬:60 KHz 工作電源電壓:3.3 V 電源電流:8 mA 工作溫度范圍:- 40 C to + 105 C 安裝風格:SMD/SMT 封裝 / 箱體:SOP-8 封裝:Tube |
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