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參數(shù)資料
| 型號(hào)： | HCPL-550X |
| 英文描述： | Hermetically Sealed, Transistor Output Optocouplers for Analog and Digital Applications |
| 中文描述： | 密封，模擬和數(shù)字晶體管輸出光電耦合器的應(yīng)用 |
| 文件頁(yè)數(shù)： | 2/12頁(yè) |
| 文件大小： | 244K |
| 代理商： | HCPL-550X |
1-560
capability will enable the designer
to interface any TTL family to
CMOS. The availability of the
base lead allows optimized gain/
bandwidth adjustment in analog
applications. The shallow depth
of the IC photodiode provides
better radiation immunity than
conventional phototransistor
couplers.
These products are also available
with the transistor base node
connected to improve common
mode noise immunity and ESD
susceptibility. In addition, higher
CTR minimums are available by
special request.
Package styles for these parts are
8 and 16 pin DIP through hole
(case outlines P and E respec-
tively), 16 pin DIP flat pack (case
outline F), and leadless ceramic
chip carrier (case outline 2).
Devices may be purchased with a
variety of lead bend and plating
options, see Selection Guide
Table for details. Standard
Military Drawing (SMD) parts are
available for each package and
lead style.
Because the same functional die
(emitters and detectors) are used
for each channel of each device
listed in this data sheet, absolute
maximum ratings, recommended
operating conditions, electrical
specifications, and performance
characteristics shown in the
figures are identical for all parts.
Occasional exceptions exist due
to package variations and
limitations and are as noted.
Additionally, the same package
assembly processes and materials
are used in all devices. These
similarities give justification for
the use of data obtained from one
part to represent other part’s
performance for die related
reliability and certain limited
radiation test results.
Selection Guide–Package Styles and Lead Configuration Options
Package
16 Pin DIP
Through Hole
2
None
8 Pin DIP
Through Hole
1
None
8 Pin DIP
Through Hole
2
V
CC
GND
16 Pin Flat Pack
Unformed Leads
4
V
CC
GND
20 Pad LCCC
Surface Mount
2
None
Lead Style
Channels
Common Channel Wiring
HP Part # & Options
Commercial
MIL-PRF-38534, Class H
MIL-PRF-38534, Class K
Standard Lead Finish
Solder Dipped
Butt Cut/Gold Plate
Gull Wing/Soldered
SMD Part #
Prescript for all below
Either Gold or Solder
Gold Plate
Solder Dipped
Butt Cut/Gold Plate
Butt Cut/Soldered
Gull Wing/Soldered
4N55*
4N55/883B
HCPL-257K
Gold Plate
Option #200
Option #100
Option #300
HCPL-5500
HCPL-5501
HCPL-550K
Gold Plate
Option #200
Option #100
Option #300
HCPL-5530
HCPL-5531
HCPL-553K
Gold Plate
Option #200
Option #100
Option #300
HCPL-6550
HCPL-6551
HCPL-655K
Gold Plate
HCPL-6530
HCPL-6531
HCPL-653K
Solder Pads
5962-
5962-
5962-
5962-
5962-
8767901EX
8767901EC
8767901EA
8767901UC
8767901UA
8767901TA
9085401HPX
9085401HPC
9085401HPA
9085401HYC
9085401HYA
9085401HXA
8767902PX
8767902PC
8767902PA
8767902YC
8767902YA
8767902XA
8767904FX
8767904FC
87679032X
87679032A
*JEDEC registered part.
8 Pin Ceramic DIP Single
Channel Schematic
ANODE
3
CATHODE
6
5
V
O
GND
I
O
I
F
2
+
–
V
F
8
V
CC
7
V
B
I
B
I
CC
Note base pin 7.
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| HCPL-5530 | 功能描述:高速光耦合器 2Ch 9MHz 1500Vdc Hermetically sealed RoHS:否 制造商:Avago Technologies 電流傳遞比: 最大波特率: 最大正向二極管電壓:1.75 V 最大反向二極管電壓:5 V 最大功率耗散:40 mW 最大工作溫度:+125 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-5 封裝:Tube |
| HCPL-5530#100 | 功能描述:高速光耦合器 2Ch 9MHz 1500Vdc Hermetically sealed RoHS:否 制造商:Avago Technologies 電流傳遞比: 最大波特率: 最大正向二極管電壓:1.75 V 最大反向二極管電壓:5 V 最大功率耗散:40 mW 最大工作溫度:+125 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-5 封裝:Tube |
| HCPL-5530#200 | 功能描述:高速光耦合器 2Ch 9MHz 1500Vdc Hermetically sealed RoHS:否 制造商:Avago Technologies 電流傳遞比: 最大波特率: 最大正向二極管電壓:1.75 V 最大反向二極管電壓:5 V 最大功率耗散:40 mW 最大工作溫度:+125 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-5 封裝:Tube |
| HCPL-5530#300 | 功能描述:高速光耦合器 2Ch 9MHz 1500Vdc Hermetically sealed RoHS:否 制造商:Avago Technologies 電流傳遞比: 最大波特率: 最大正向二極管電壓:1.75 V 最大反向二極管電壓:5 V 最大功率耗散:40 mW 最大工作溫度:+125 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-5 封裝:Tube |
| HCPL-5531 | 功能描述:高速光耦合器 2Ch 9MHz 1500Vdc Hermetically sealed RoHS:否 制造商:Avago Technologies 電流傳遞比: 最大波特率: 最大正向二極管電壓:1.75 V 最大反向二極管電壓:5 V 最大功率耗散:40 mW 最大工作溫度:+125 C 最小工作溫度:- 40 C 封裝 / 箱體:SOIC-5 封裝:Tube |
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