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參數(shù)資料
| 型號： | HC5503PRCBZ96 |
| 廠商： | INTERSIL CORP |
| 元件分類： | 模擬傳輸電路 |
| 英文描述： | Low Cost SLIC For Large Telecom Switches |
| 中文描述： | TELECOM-SLIC, PDSO24 |
| 封裝： | LEAD FREE, PLASTIC, MS-013AD, SOIC-24 |
| 文件頁數(shù)： | 11/11頁 |
| 文件大?。?/td> | 265K |
| 代理商： | HC5503PRCBZ96 |
11
HC5503PRC
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP)
INDEX
AREA
D1/2
D1
D/2
D
E1/2
E/2
E
A
2X
0.15
B
C
0.10
B
A
M C
A
N
SEATING PLANE
N
6
3
2
2
3
e
(Nd-1)Xe
1
1
0.08
FOR ODD TERMINAL/SIDE
FOR EVEN TERMINAL/SIDE
C
C
SECTION "C-C"
NX b
A1
C
2X
C
0.15
0.15
2X
B
0
REF.
(Ne-1)Xe
REF.
5
A1
4X P
A
C
C
4X P
B
2X
A
C
0.15
A2
A3
D2
D2
2
E2
E2/2
TERMINAL TIP
SIDE VIEW
TOP VIEW
7
BOTTOM VIEW
7
5
C
C
e
e
E1
NX k
NX b
8
NX L
8
8
9
9
4X
0.10 C
/ /
9
(DATUM B)
(DATUM A)
INDEX
AREA
6
N
9
CORNER
OPTION 4X
L1
L
10
L1
L
10
L32.7x7
32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220VKKC ISSUE C)
SYMBOL
A
A1
A2
A3
b
D
D1
D2
E
E1
E2
e
k
L
L1
N
Nd
Ne
P
θ
MILLIMETERS
TYP
0.90
-
-
0.20 REF
0.28
7.00 BSC
6.75 BSC
4.70
7.00 BSC
6.75 BSC
4.70
0.65 BSC
-
0.60
-
32
8
8
-
-
NOTES
-
-
9
9
5, 8
-
9
7, 8
-
9
7, 8
-
-
8
10
2
3
3
9
9
Rev. 4 8/03
MIN
0.80
-
-
MAX
1.00
0.05
1.00
0.23
0.38
4.55
4.85
4.55
4.85
0.25
0.50
-
0.75
0.15
-
-
-
0.60
12
NOTES:
1. Dimensioning and tolerancing conform to ASME Y14.5-1994.
2. N is the number of terminals.
3. Nd and Ne refer to the number of terminals on each D and E.
4. All dimensions are in millimeters. Angles are in degrees.
5. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 identifier may be
either a mold or mark feature.
7. Dimensions D2 and E2 are for the exposed pads which provide
improved electrical and thermal performance.
8. Nominal dimensions are provided to assist with PCB Land
Pattern Design efforts, see Intersil Technical Brief TB389.
9. Features and dimensions A2, A3, D1, E1, P &
θ
are present
when Anvil singulation method is used and not present for saw
singulation.
10. Depending on the method of lead termination at the edge of the
package, a maximum 0.15mm pull back (L1) maybe present. L
minus L1 to be equal to or greater than 0.3mm.
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| HC5503PRCR | Low Cost SLIC For Large Telecom Switches |
| HC5503PRCRZ | Low Cost SLIC For Large Telecom Switches |
| HC5503PRCRZ96 | Low Cost SLIC For Large Telecom Switches |
| HC5503PRC | Low Cost SLIC For Large Telecom Switches(低成本應(yīng)用于大型電信開關(guān)的用戶線接口) |
| HC5503PR | () |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HC5503PRCM | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| HC5503PRCR | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Low Cost SLIC For Large Telecom Switches |
| HC5503PRCRZ | 功能描述:電信線路管理 IC COST SLIC FOR LONG LOOPS 32LD MLFP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray |
| HC5503PRCRZ96 | 功能描述:電信線路管理 IC COST SLIC FOR LONG LOOPS 32LD MLFP RoHS:否 制造商:STMicroelectronics 產(chǎn)品:PHY 接口類型:UART 電源電壓-最大:18 V 電源電壓-最小:8 V 電源電流:30 mA 最大工作溫度:+ 85 C 最小工作溫度:- 40 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:VFQFPN-48 封裝:Tray |
| HC5503PRI | 制造商:INTERSIL 制造商全稱:Intersil Corporation 功能描述:Low Cost SLIC For Large Telecom Switches |
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