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參數(shù)資料
| 型號： | HA9P5002-5Z |
| 廠商： | INTERSIL CORP |
| 元件分類： | 運動控制電子 |
| 英文描述： | 110MHz, High Slew Rate, High Output Current Buffer |
| 中文描述： | BUFFER AMPLIFIER, PDSO8 |
| 封裝： | GREEN, PLASTIC, MS-012AA, SOIC-8 |
| 文件頁數(shù)： | 14/14頁 |
| 文件大?。?/td> | 864K |
| 代理商： | HA9P5002-5Z |
14
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
FN2921.11
March 8, 2006
HA-5002
Small Outline Plastic Packages (SOIC)
INDEX
AREA
E
D
N
1
2
3
-B-
0.25(0.010)
C A
M
B S
e
-A-
L
B
M
-C-
A1
A
SEATING PLANE
0.10(0.004)
h x 45°
C
H
0.25(0.010)
B
M
M
α
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M
-
1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Inter-
lead flash and protrusions shall not exceed 0.25mm (0.010 inch) per
side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch).
10. Controlling dimension: MILLIMETER. Converted inch dimensions
are not necessarily exact.
M8.15
(JEDEC MS-012-AA ISSUE C)
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
SYMBOL
INCHES
MILLIMETERS
NOTES
MIN
MAX
MIN
MAX
A
0.0532
0.0688
1.35
1.75
-
A1
0.0040
0.0098
0.10
0.25
-
B
0.013
0.020
0.33
0.51
9
C
0.0075
0.0098
0.19
0.25
-
D
0.1890
0.1968
4.80
5.00
3
E
0.1497
0.1574
3.80
4.00
4
e
0.050 BSC
1.27 BSC
-
H
0.2284
0.2440
5.80
6.20
-
h
0.0099
0.0196
0.25
0.50
5
L
0.016
0.050
0.40
1.27
6
N
α
8
8
7
0°
8°
0°
8°
-
Rev. 1 6/05
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| HA9P5002-5Z | 制造商:Intersil Corporation 功能描述:IC AMPLIFIER 110MHZ |
| HA9P50029 | 制造商:HARRIS 功能描述:HA9P5002-9 |
| HA9P5002-9 | 功能描述:IC BUFFER 110MHZ HIGH OUT 8-SOIC RoHS:否 類別:集成電路 (IC) >> Linear - Amplifiers - Instrumentation 系列:- 標準包裝:50 系列:LinCMOS™ 放大器類型:通用 電路數(shù):4 輸出類型:- 轉(zhuǎn)換速率:0.05 V/µs 增益帶寬積:110kHz -3db帶寬:- 電流 - 輸入偏壓:0.7pA 電壓 - 輸入偏移:210µV 電流 - 電源:57µA 電流 - 輸出 / 通道:30mA 電壓 - 電源，單路/雙路(±):3 V ~ 16 V，±1.5 V ~ 8 V 工作溫度:-40°C ~ 85°C 安裝類型:表面貼裝 封裝/外殼:14-SOIC（0.154"，3.90mm 寬） 供應商設(shè)備封裝:14-SOIC 包裝:管件 產(chǎn)品目錄頁面:865 (CN2011-ZH PDF) 其它名稱:296-1834296-1834-5 |
| HA9P5002-9X96 | 制造商:INTERSIL CORPORATION 功能描述: 制造商:INTRSL 功能描述: |
| HA9P5002-9Z | 功能描述:緩沖器和線路驅(qū)動器 W/ANNEAL BUFR 110MHZ VFB COM RoHS:否 制造商:Micrel 輸入線路數(shù)量:1 輸出線路數(shù)量:2 極性:Non-Inverting 電源電壓-最大:+/- 5.5 V 電源電壓-最小:+/- 2.37 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MSOP-8 封裝:Reel |
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