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參數(shù)資料
| 型號： | GTL2107 |
| 廠商： | NXP Semiconductors N.V. |
| 英文描述： | 12-bit GTL to LVTTL translator with power good control and high-impedance LVTTL and GTL outputs |
| 中文描述： | 12位的GTL的LVTTL與翻譯良好的控制權和高阻抗輸出LVTTL和GTL |
| 文件頁數(shù)： | 18/20頁 |
| 文件大小： | 102K |
| 代理商： | GTL2107 |
GTL2008_GTL2107_2
Koninklijke Philips Electronics N.V. 2006. All rights reserved.
Product data sheet
Rev. 02 — 26 September 2006
18 of 20
Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
[3]
These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217
°
C
±
10
°
C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[4]
These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5]
If wave soldering is considered, then the package must be placed at a 45
°
angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6]
Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7]
Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8]
Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9]
Hot bar soldering or manual soldering is suitable for PMFP packages.
16. Abbreviations
17. Revision history
Table 17.
Acronym
CDM
CMOS
CPU
DUT
ESD
GTL
HBM
LVTTL
MM
PRR
TTL
VRD
Abbreviations
Description
Charged Device Model
Complementary Metal Oxide Semiconductor
Central Processing Unit
Device Under Test
ElectroStatic Discharge
Gunning Transceiver Logic
Human Body Model
Low Voltage Transistor-Transistor Logic
Machine Model
Pulse Rate Repetition
Transistor-Transistor Logic
Voltage Regulator Down
Table 18.
Document ID
GTL2008_GTL2107_2
Modifications:
Revision history
Release date
20060926
Added type number GTL2017
Section 1 “General description”
: added new 7th paragraph
Section 4 “Ordering information”
: added type number GTL2107PW to
Table 2 “Ordering
information”
and following paragraph
Table 10 “Limiting values”
: removed (old) Table note 1 (information is now in
Section 18
“Legal information”
)
added “DUT” to
Table 17 “Abbreviations”
20060502
Product data sheet
Data sheet status
Product data sheet
Change notice
-
Supersedes
GTL2008_1
GTL2008_1
-
-
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| GTL2107PW | 功能描述:轉換 - 電壓電平 12-BIT XEON GTL TO LVTTL TRANS RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MLF-8 |
| GTL2107PW,112 | 功能描述:轉換 - 電壓電平 12-BIT XEON GTL TO RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MLF-8 |
| GTL2107PW,118 | 功能描述:轉換 - 電壓電平 12-BIT XEON GTL TO RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MLF-8 |
| GTL2107PW118 | 制造商:Rochester Electronics LLC 功能描述: 制造商:NXP 功能描述: 制造商:NXP Semiconductors 功能描述: |
| GTL2107PW-T | 功能描述:轉換 - 電壓電平 12-BIT XEON GTL TO LVTTL TRANS RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風格:SMD/SMT 封裝 / 箱體:MLF-8 |
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