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| 型號： | GTL2010PW |
| 廠商： | NXP Semiconductors N.V. |
| 元件分類： | 電壓/頻率轉(zhuǎn)換 |
| 英文描述： | 10-bit bidirectional low voltage translator |
| 封裝： | GTL2010BS<SOT616-1 (HVQFN24)|<<http://www.nxp.com/packages/SOT616-1.html<1<Always Pb-free,;GTL2010PW<SOT355-1 (TSSOP24)|<<http://www.nxp.com/packages/SOT355-1.html<1&l |
| 文件頁數(shù)： | 16/20頁 |
| 文件大小： | 117K |
| 代理商： | GTL2010PW |
GTL2010_6
NXP B.V. 2008. All rights reserved.
Product data sheet
Rev. 06 — 3 March 2008
16 of 20
NXP Semiconductors
GTL2010
10-bit bidirectional low voltage translator
15.4 Reflow soldering
Key characteristics in reflow soldering are:
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
Figure 13
) than a SnPb process, thus
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 13
and
14
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Figure 13
.
Table 13.
Package thickness (mm)
SnPb eutectic process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
235
220
≥
350
220
220
< 2.5
≥
2.5
Table 14.
Package thickness (mm)
Lead-free process (from J-STD-020C)
Package reflow temperature (
°
C)
Volume (mm
3
)
< 350
260
260
250
350 to 2000
260
250
245
> 2000
260
245
245
< 1.6
1.6 to 2.5
> 2.5
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| GTL2010PW,112 | 功能描述:轉(zhuǎn)換 - 電壓電平 1-BIT GTL VOLTAGE CLAMP TRANS RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| GTL2010PW,118 | 功能描述:轉(zhuǎn)換 - 電壓電平 1-BIT GTL VOLTAGE RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| GTL2010PW/G,118 | 功能描述:IC VOLT TRANSLATOR 24-TSSOP RoHS:是 類別:集成電路 (IC) >> 邏輯 - 變換器 系列:- 產(chǎn)品培訓(xùn)模塊:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 標(biāo)準(zhǔn)包裝:100 系列:- 邏輯功能:變換器，雙向 位數(shù):2 輸入類型:CMOS 輸出類型:CMOS 數(shù)據(jù)速率:16Mbps 通道數(shù):2 輸出/通道數(shù)目:1 差分 - 輸入:輸出:無/無 傳輸延遲（最大）:15ns 電源電壓:1.65 V ~ 5.5 V 工作溫度:-40°C ~ 85°C 封裝/外殼:10-UFQFN 供應(yīng)商設(shè)備封裝:10-UTQFN（1.4x1.8） 包裝:管件 |
| GTL2010PW/N,118 | 功能描述:轉(zhuǎn)換 - 電壓電平 1-BIT GTL VOLTAGE RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
| GTL2010PW/N-T | 功能描述:轉(zhuǎn)換 - 電壓電平 1-BIT GTL VOLTAGE CLAMP TRANS RoHS:否 制造商:Micrel 類型:CML/LVDS/LVPECL to LVCMOS/LVTTL 傳播延遲時(shí)間:1.9 ns 電源電流:14 mA 電源電壓-最大:3.6 V 電源電壓-最小:3 V 最大工作溫度:+ 85 C 安裝風(fēng)格:SMD/SMT 封裝 / 箱體:MLF-8 |
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