參數(shù)資料
型號(hào)： GTL1655DGG
廠商： NXP Semiconductors N.V.
元件分類： 電壓/頻率轉(zhuǎn)換
英文描述： 16-bit LVTTL-to-GTL-GTL+ bus transceiver with live insertion
封裝： GTL1655DGG<SOT646-1 (TSSOP64)|<<http://www.nxp.com/packages/SOT646-1.html<1<week 3, 2006,;GTL1655DGG<SOT646-1 (TSSOP64)|<<http://www.nxp.com/packages/SOT646-1.html<1&l
文件頁(yè)數(shù)： 19/23頁(yè)
文件大?。?/td> 127K
代理商： GTL1655DGG
Philips Semiconductors
GTL1655
16-bit LVTTL-to-GTL/GTL+ bus transceiver with live insertion
Product data
Rev. 01 — 11 May 2004
19 of 23
9397 750 12936
Koninklijke Philips Electronics N.V. 2004. All rights reserved.
13. Soldering
13.1 Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology. A more in-depth account
of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit
Packages(document order number 9398 652 90011).
There is no soldering method that is ideal for all surface mount IC packages. Wave
soldering can still be used for certain surface mount ICs, but it is not suitable for fine
pitch SMDs. In these situations reflow soldering is recommended. In these situations
reflow soldering is recommended.
13.2 Reflow soldering
Reflow soldering requires solder paste (a suspension of fine solder particles, flux and
binding agent) to be applied to the printed-circuit board by screen printing, stencilling
or pressure-syringe dispensing before package placement. Driven by legislation and
environmental forces the worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example, convection or convection/infrared
heating in a conveyor type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending on heating method.
Typical reflow peak temperatures range from 215 to 270
°
C depending on solder
paste material. The top-surface temperature of the packages should preferably be
kept:
below 225
°
C (SnPb process) or below 245
°
C (Pb-free process)
–
for all BGA, HTSSON..T and SSOP..T packages
–
for packages with a thickness
≥
2.5 mm
–
for packages with a thickness < 2.5 mm and a volume
≥
350 mm
3
so called
thick/large packages.
below 240
°
C (SnPb process) or below 260
°
C (Pb-free process) for packages with
a thickness < 2.5 mm and a volume < 350 mm
3
so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing, must be respected at all
times.
13.3 Wave soldering
Conventional single wave soldering is not recommended for surface mount devices
(SMDs) or printed-circuit boards with a high component density, as solder bridging
and non-wetting can present major problems.
To overcome these problems the double-wave soldering method was specifically
developed.
If wave soldering is used the following conditions must be observed for optimal
results:
Use a double-wave soldering method comprising a turbulent wave with high
upward pressure followed by a smooth laminar wave.
相關(guān)PDF資料
PDF描述
GTL2000DL 22-bit bi-directional low voltage translator
GTL2000DGG 22-bit bi-directional low voltage translator
GTL2002D 2-bit bidirectional low voltage translator
GTL2002DP 2-bit bidirectional low voltage translator
GTL2002DC 2-bit bidirectional low voltage translator
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
GTL1655DGG,512 功能描述:總線收發(fā)器 16-BIT LVTTL TO GTL RoHS:否 制造商:Fairchild Semiconductor 邏輯類型:CMOS 邏輯系列:74VCX 每芯片的通道數(shù)量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時(shí)間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel
GTL1655DGG,518 功能描述:總線收發(fā)器 16-BIT LVTTL TO GTL RoHS:否 制造商:Fairchild Semiconductor 邏輯類型:CMOS 邏輯系列:74VCX 每芯片的通道數(shù)量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時(shí)間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel
GTL1655DGG-T 功能描述:總線收發(fā)器 16-BIT LVTTL TO GTL UBT (3-S) RoHS:否 制造商:Fairchild Semiconductor 邏輯類型:CMOS 邏輯系列:74VCX 每芯片的通道數(shù)量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時(shí)間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel
GTL16612 制造商:PHILIPS 制造商全稱:NXP Semiconductors 功能描述:18-bit GTL/GTL+ to LVTTL/TTL bidirectional universal translator (3-State)
GTL16612DG 功能描述:總線收發(fā)器 18-BIT GTL/GTL + TO LVTTL/TTL RoHS:否 制造商:Fairchild Semiconductor 邏輯類型:CMOS 邏輯系列:74VCX 每芯片的通道數(shù)量:16 輸入電平:CMOS 輸出電平:CMOS 輸出類型:3-State 高電平輸出電流:- 24 mA 低電平輸出電流:24 mA 傳播延遲時(shí)間:6.2 ns 電源電壓-最大:2.7 V, 3.6 V 電源電壓-最小:1.65 V, 2.3 V 最大工作溫度:+ 85 C 封裝 / 箱體:TSSOP-48 封裝:Reel
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