
GS9090 Data Sheet
28201 - 1
July 2005
4 of 70
3.9.7  Error Detection and Indication ............................................................38
3.9.8  Error Correction and Insertion ............................................................43
3.10  Internal FIFO Operation..............................................................................46
3.10.1  Video Mode.......................................................................................46
3.10.2  DVB-ASI Mode .................................................................................48
3.10.3  Ancillary Data Extraction Mode.........................................................51
3.10.4  Bypass Mode....................................................................................54
3.11  Parallel Data Outputs..................................................................................55
3.11.1  Parallel Data Bus..............................................................................55
3.11.2  Parallel Output in SMPTE Mode.......................................................56
3.11.3  Parallel Output in DVB-ASI Mode.....................................................56
3.11.4  Parallel Output in Data-Through Mode.............................................56
3.12  Programmable Multi-Function Outputs .......................................................56
3.13  GS9090 Low-latency Mode.........................................................................58
3.14  GSPI Host Interface....................................................................................59
3.14.1  Command Word Description.............................................................60
3.14.2  Data Read and Write Timing ............................................................60
3.14.3  Configuration and Status Registers..................................................62
3.15  Reset Operation..........................................................................................63
3.16  JTAG Operation..........................................................................................63
3.17  Device Power Up ........................................................................................64
4.  References & Relevant Standards.........................................................................65
5.  Application Information...........................................................................................66
5.1  Typical Application Circuit (Part A) ...............................................................66
5.2  Typical Application Circuit (Part B) ...............................................................67
6.  Package & Ordering Information............................................................................68
6.1  Package Dimensions ....................................................................................68
6.2  Recommended PCB Footprint......................................................................69
6.3  Packaging Data.............................................................................................69
6.4  Ordering Information.....................................................................................69
7.  Revision History .....................................................................................................70