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參數(shù)資料
| 型號(hào)： | GS84036AB-166 |
| 廠(chǎng)商： | Electronic Theatre Controls, Inc. |
| 英文描述： | 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs |
| 中文描述： | 256 × 18，128K的× 32，128K的× 36 4Mb的同步突發(fā)靜態(tài)存儲(chǔ)器 |
| 文件頁(yè)數(shù)： | 16/31頁(yè) |
| 文件大小： | 911K |
| 代理商： | GS84036AB-166 |
第1頁(yè)第2頁(yè)第3頁(yè)第4頁(yè)第5頁(yè)第6頁(yè)第7頁(yè)第8頁(yè)第9頁(yè)第10頁(yè)第11頁(yè)第12頁(yè)第13頁(yè)第14頁(yè)第15頁(yè)當(dāng)前第16頁(yè)第17頁(yè)第18頁(yè)第19頁(yè)第20頁(yè)第21頁(yè)第22頁(yè)第23頁(yè)第24頁(yè)第25頁(yè)第26頁(yè)第27頁(yè)第28頁(yè)第29頁(yè)第30頁(yè)第31頁(yè)
Rev: 1.12 7/2002
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com
16/31
1999, Giga Semiconductor, Inc.
Preliminary
GS84018/32/36AT/B-180/166/150/100
Capacitance
(T
A
= 25
o
C, f = 1 MH
Z
, V
DD
= 3.3 V)
Note: This parameter is sample tested.
Package Thermal Characteristics
Notes:
1.
Junction temperature is a function of SRAM power dissipation, package thermal resistance, mounting board temperature, ambient. Temper-
ature air flow, board density, and PCB thermal resistance.
SCMI G-38-87.
Average thermal resistance between die and top surface, MIL SPEC-883, Method 1012.1.
4. For x18 configuration, consult factory.
2.
3.
Parameter
Symbol
Test conditions
Typ.
Max.
Unit
Control Input Capacitance
C
I
C
IN
C
OUT
V
DD
= 3.3 V
V
IN
= 0 V
V
OUT
= 0 V
3
4
pF
Input Capacitance
4
5
pF
Output Capacitance
6
7
pF
Rating
Layer Board
Symbol
TQFP Max
BGA Max
Unit
Notes
Junction to Ambient (at 200 lfm)
single
R
Θ
JA
R
Θ
JA
R
Θ
JC
40
38
°
C/W
°
C/W
°
C/W
1,2,4
Junction to Ambient (at 200 lfm)
four
24
21
1,2,4
Junction to Case (TOP)
9
5
3,4
20% tKC
V
SS
-2.0V
50%
V
SS
V
IH
Undershoot Measurement and Timing
Overshoot Measurement and Timing
20% tKC
V
DD
+-2.0V
50%
V
DD
V
IL
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PDF描述 |
|---|---|
| GS84036AB-166I | 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs |
| GS84032AT-166I | 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs |
| GS84032AT-180 | 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs |
| GS84036AT-150 | XC17S15AVOG8C |
| GS84036AT-150I | 256K x 18, 128K x 32, 128K x 36 4Mb Sync Burst SRAMs |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| GS84036AB-166I | 制造商:GSI Technology 功能描述:SRAM SYNC SGL 3.3V 4.5MBIT 128KX36 8.5NS/3.5NS 119FBGA - Trays |
| GS84036AB-180 | 制造商:GSI Technology 功能描述:SRAM SYNC SGL 3.3V 4.5MBIT 128KX36 8NS/3NS 119FBGA - Trays |
| GS84036AB-180I | 制造商:GSI Technology 功能描述:SRAM SYNC SGL 3.3V 4.5MBIT 128KX36 8NS/3NS 119FBGA - Trays |
| GS84036AGB-100 | 制造商:GSI Technology 功能描述:SRAM SYNC SGL 3.3V 4.5MBIT 128KX36 12NS/4.5NS 119FBGA - Trays |
| GS84036AGB-100I | 制造商:GSI Technology 功能描述:SRAM SYNC SGL 3.3V 4.5MBIT 128KX36 12NS/4.5NS 119FBGA - Trays |
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