參數(shù)資料
型號(hào): GS816136D-166I
廠商: Electronic Theatre Controls, Inc.
英文描述: 2 ROW 4PIN 30U GOLD
中文描述: 165焊球BGA封裝?x18 Commom的I / O?頂視圖(D組)
文件頁數(shù): 36/40頁
文件大?。?/td> 1391K
代理商: GS816136D-166I
Rev: 2.12 9/2002
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
28/32
1999, Giga Semiconductor, Inc.
GS816118/36T-250/225/200/166/150/133
JTAG Port Timing Diagram
JTAG Port AC Electrical Characteristics
Boundary Scan (BSDL Files)
For information regarding the Boundary Scan Chain, or to obtain BSDL files for this part, please contact our Applications
Engineering Department at: apps@gsitechnology.com.
Parameter
TCK Cycle Time
TCK Low to TDO Valid
TCK High Pulse Width
TCK Low Pulse Width
TDI & TMS Set Up Time
TDI & TMS Hold Time
Symbol
tTKC
tTKQ
tTKH
tTKL
tTS
tTH
Min
50
20
20
10
10
Max
20
Unit
ns
ns
ns
ns
ns
ns
tTKQ
tTS
tTH
tTKH
tTKL
TCK
TMS
TDI
TDO
tTKC
相關(guān)PDF資料
PDF描述
GS816136D-200 2 ROW, 4PIN, 30 U GOLD
GS816136D-200I 165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-225 Pin Strip Header; No. of Contacts:36; Pitch Spacing:0.1"; No. of Rows:2; Contact Material:Copper Alloy; Contact Plating:Gold; Leaded Process Compatible:Yes; Mounting Type:PCB Straight Thru Hole; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
GS816136D-225I 165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-250 Pin Strip Header; No. of Contacts:36; Pitch Spacing:0.1"; No. of Rows:2; Contact Material:Copper Alloy; Contact Plating:Gold; Mounting Type:PCB Straight Thru Hole; Terminal Type:Solder Tail; Pin Length:0.318" RoHS Compliant: Yes
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
GS816136D-200 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-200I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-225 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-225I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-250 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)