參數(shù)資料
型號(hào)： GS816132D-250I
廠商： Electronic Theatre Controls, Inc.
英文描述： 165 Bump BGA?x18 Commom I/O?Top View (Package D)
中文描述： 165焊球BGA封裝？x18 Commom的I / O？頂視圖（D組）
文件頁(yè)數(shù)： 24/40頁(yè)
文件大小： 1391K
代理商： GS816132D-250I
Rev: 2.12 9/2002
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
16/32
1999, Giga Semiconductor, Inc.
GS816118/36T-250/225/200/166/150/133
AC Electrical Characteristics
Notes:
1.
2.
These parameters are sampled and are not 100% tested
ZZ is an asynchronous signal. However, In order to be recognized on any given clock cycle, ZZ must meet the specified setup and hold
times as specified above.
Parameter
Symbol
-250
-225
-200
-166
-150
-133
Unit
Min
4.0
—
1.5
Max
—
2.5
—
Min
4.4
—
1.5
Max
—
2.7
—
Min
5.0
—
1.5
Max
—
3.0
—
Min
6.0
—
1.5
Max
—
3.4
—
Min
6.7
—
1.5
Max
—
3.8
—
Min
7.5
—
1.5
Max
—
4.0
—
Pipeline
Clock Cycle Time
Clock to Output Valid
Clock to Output Invalid
tKC
tKQ
tKQX
ns
ns
ns
Clock to Output in Low-Z
tLZ
1
tS
tH
tKC
tKQ
tKQX
1.5
—
1.5
—
1.5
—
1.5
—
1.5
—
1.5
—
ns
Setup time
Hold time
Clock Cycle Time
Clock to Output Valid
Clock to Output Invalid
1.2
0.2
5.5
—
3.0
—
—
—
5.5
—
1.3
0.3
6.0
—
3.0
—
—
—
6.0
—
1.4
0.4
6.5
—
3.0
—
—
—
6.5
—
1.5
0.5
7.0
—
3.0
—
—
—
7.0
—
1.5
0.5
7.5
—
3.0
—
—
—
7.5
—
1.5
0.5
8.5
—
3.0
—
—
—
8.5
—
ns
ns
ns
ns
ns
Flow
Through
Clock to Output in Low-Z
tLZ
1
tS
tH
tKH
tKL
3.0
—
3.0
—
3.0
—
3.0
—
3.0
—
3.0
—
ns
Setup time
Hold time
Clock HIGH Time
Clock LOW Time
Clock to Output in
High-Z
G to Output Valid
1.5
0.5
1.3
1.5
—
—
—
—
1.5
0.5
1.3
1.5
—
—
—
—
1.5
0.5
1.3
1.5
—
—
—
—
1.5
0.5
1.3
1.5
—
—
—
—
1.5
0.5
1.5
1.7
—
—
—
—
1.5
0.5
1.7
2
—
—
—
—
ns
ns
ns
ns
tHZ
1
1.5
2.3
1.5
2.5
1.5
3.0
1.5
3.0
1.5
3.0
1.5
3.0
ns
tOE
—
2.3
—
2.5
—
3.2
—
3.5
—
3.8
—
4.0
ns
G to output in Low-Z
tOLZ
1
0
—
0
—
0
—
0
—
0
—
0
—
ns
G to output in High-Z
tOHZ
1
—
2.3
—
2.5
—
3.0
—
3.0
—
3.0
—
3.0
ns
ZZ setup time
tZZS
2
5
—
5
—
5
—
5
—
5
—
5
—
ns
ZZ hold time
tZZH
2
tZZR
1
—
1
—
1
—
1
—
1
—
1
—
ns
ZZ recovery
20
—
20
—
20
—
20
—
20
—
20
—
ns
相關(guān)PDF資料
PDF描述
GS816136D-133 165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-133I PCB Header; No. of Contacts:72; Pitch Spacing:0.1"; No. of Rows:2; Series:929; Body Material:Glass-Filled Polyester; Contact Material:Copper Alloy; Contact Plating:Tin-Lead Over Nickel; Mounting Type:PCB Straight Thru Hole RoHS Compliant: Yes
GS816136D-150 PCB Header; No. of Contacts:72; Pitch Spacing:0.1"; No. of Rows:2; Series:929; Body Material:Glass-Filled Polyester; Contact Material:Copper Alloy; Contact Plating:Tin; Leaded Process Compatible:Yes RoHS Compliant: Yes
GS816136D-150I 165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816136D-166 165 Bump BGA?x18 Commom I/O?Top View (Package D)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
GS816132DD-150 制造商:GSI Technology 功能描述:165 BGA - Bulk
GS816132DD-150I 制造商:GSI Technology 功能描述:165 BGA - Bulk
GS816132DD-150IV 制造商:GSI Technology 功能描述:165 BGA - Bulk
GS816132DD-150V 制造商:GSI Technology 功能描述:165 BGA - Bulk
GS816132DD-200 制造商:GSI Technology 功能描述:165 BGA - Bulk
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