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參數(shù)資料
| 型號： | GS816132D-250 |
| 廠商： | Electronic Theatre Controls, Inc. |
| 英文描述： | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| 中文描述： | 165焊球BGA封裝？x18 Commom的I / O？頂視圖（D組） |
| 文件頁數(shù)： | 21/40頁 |
| 文件大?。?/td> | 1391K |
| 代理商： | GS816132D-250 |
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Rev: 2.12 9/2002
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
13/32
1999, Giga Semiconductor, Inc.
GS816118/36T-250/225/200/166/150/133
Capacitance
(T
A
= 25
o
C, f = 1 MH
Z
, V
DD
= 2.5 V)
Note: These parameters are sample tested.
Package Thermal Characteristics
Notes:
1.
Junction temperature is a function of SRAM power dissipation, package thermal resistance, mounting board temperature, ambient. Temper-
ature air flow, board density, and PCB thermal resistance.
SCMI G-38-87
Average thermal resistance between die and top surface, MIL SPEC-883, Method 1012.1
2.
3.
Recommended Operating Temperatures
Parameter
Symbol
Min.
Typ.
Max.
Unit
Notes
Ambient Temperature (Commercial Range Versions)
T
A
0
25
70
°
C
2
Ambient Temperature (Industrial Range Versions)
T
A
–
40
25
85
°
C
2
Note:
1.
The part numbers of Industrial Temperature Range versions end the character “I”. Unless otherwise noted, all performance specifications quoted are
evaluated for worst case in the temperature range marked on the device.
Input Under/overshoot voltage must be
–
2 V > Vi < V
DDn
+2 V not to exceed 4.6 V maximum, with a pulse width not to exceed 20% tKC.
2.
Parameter
Symbol
C
IN
C
I/O
Test conditions
V
IN
= 0 V
V
OUT
= 0 V
Typ.
Max.
Unit
Input Capacitance
4
5
pF
Input/Output Capacitance
6
7
pF
Rating
Layer Board
Symbol
R
Θ
JA
R
Θ
JA
R
Θ
JC
Max
Unit
Notes
Junction to Ambient (at 200 lfm)
single
40
°
C/W
°
C/W
°
C/W
1,2
Junction to Ambient (at 200 lfm)
four
24
1,2
Junction to Case (TOP)
—
9
3
20% tKC
V
SS
–
2.0 V
50%
V
SS
V
IH
Undershoot Measurement and Timing
Overshoot Measurement and Timing
20% tKC
V
DD
+ 2.0 V
50%
V
DD
V
IL
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| GS816132D-250I | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816136D-133 | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816136D-133I | PCB Header; No. of Contacts:72; Pitch Spacing:0.1"; No. of Rows:2; Series:929; Body Material:Glass-Filled Polyester; Contact Material:Copper Alloy; Contact Plating:Tin-Lead Over Nickel; Mounting Type:PCB Straight Thru Hole RoHS Compliant: Yes |
| GS816136D-150 | PCB Header; No. of Contacts:72; Pitch Spacing:0.1"; No. of Rows:2; Series:929; Body Material:Glass-Filled Polyester; Contact Material:Copper Alloy; Contact Plating:Tin; Leaded Process Compatible:Yes RoHS Compliant: Yes |
| GS816136D-150I | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| GS816132D-250I | 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816132DD-150 | 制造商:GSI Technology 功能描述:165 BGA - Bulk |
| GS816132DD-150I | 制造商:GSI Technology 功能描述:165 BGA - Bulk |
| GS816132DD-150IV | 制造商:GSI Technology 功能描述:165 BGA - Bulk |
| GS816132DD-150V | 制造商:GSI Technology 功能描述:165 BGA - Bulk |
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