參數(shù)資料
型號: GS816132D-200
廠商: Electronic Theatre Controls, Inc.
英文描述: 165 Bump BGA?x18 Commom I/O?Top View (Package D)
中文描述: 165焊球BGA封裝?x18 Commom的I / O?頂視圖(D組)
文件頁數(shù): 14/40頁
文件大小: 1391K
代理商: GS816132D-200
Rev: 2.12 9/2002
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
6/32
1999, Giga Semiconductor, Inc.
GS816118/36T-250/225/200/166/150/133
Mode Pin Functions
Note:
There arepull-up devices on the FT pin and a pull-down device on the ZZ pin, so those input pins can be unconnected and the chip
will operate in the default states as specified in the above tables.
Burst Counter Sequences
Linear Burst Sequence
BPR 1999.05.18
Mode Name
Pin
Name
State
Function
Burst Order Control
LBO
L
H
L
Linear Burst
Interleaved Burst
Flow Through
Pipeline
Active
Standby, I
DD
= I
SB
Output Register Control
FT
H or NC
L or NC
Power Down Control
ZZ
H
Note: The burst counter wraps to initial state on the 5th clock.
I
nterleaved Burst Sequence
Note: The burst counter wraps to initial state on the 5th clock.
A[1:0] A[1:0] A[1:0] A[1:0]
1st address
00
01
10
11
2nd address
01
10
11
00
3rd address
10
11
00
01
4th address
11
00
01
10
A[1:0] A[1:0] A[1:0] A[1:0]
1st address
00
01
10
11
2nd address
01
00
11
10
3rd address
10
11
00
01
4th address
11
10
01
00
相關PDF資料
PDF描述
GS816132D-200I 165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816132D-225 Pin Strip Header; No. of Contacts:36; Pitch Spacing:0.1"; No. of Rows:1; Contact Material:Copper Alloy; Contact Plating:Tin-Lead Over Nickel; Leaded Process Compatible:No; Mounting Type:PCB Straight Thru Hole RoHS Compliant: No
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相關代理商/技術參數(shù)
參數(shù)描述
GS816132D-200I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816132D-225 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816132D-225I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816132D-250 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816132D-250I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)