參數(shù)資料
型號(hào)： GS816132D-166
廠商： Electronic Theatre Controls, Inc.
英文描述： 165 Bump BGA?x18 Commom I/O?Top View (Package D)
中文描述： 165焊球BGA封裝？x18 Commom的I / O？頂視圖（D組）
文件頁(yè)數(shù)： 8/40頁(yè)
文件大小： 1391K
代理商： GS816132D-166
8/8
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Revision: 9/26/02
GS816118/32/36D
Supplemental Datasheet Information
512K x 32
512K x 32
512K x 32
512K x 32
512K x 36
512K x 36
512K x 36
512K x 36
512K x 36
512K x 36
Notes:
1.
Customers requiring delivery in Tape and Reel should add the character “T” to the end of the part number. Example: GS816136AD-100IT.
2.
The speed column indicates the cycle frequency (MHz) of the device in Pipeline mode and the latency (ns) in Flow Through mode. Each
device is Pipeline/Flow Through mode-selectable by the user.
3.
T
A
= C = Commercial Temperature Range. T
A
= I = Industrial Temperature Range.
4.
GSI offers other versions this type of device in many different configurations and with a variety of different features, only some of which
are covered in this data sheet. See the GSI Technology web site (www.gsitechnology.com) for a complete listing of current offerings
GS816132D-200I
GS816132D-166I
GS816132D-150I
GS816132D-133I
GS816136D-250I
GS816136D-225I
GS816136D-200I
GS816136D-166I
GS816136D-150I
GS816136D-133I
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
Pipeline/Flow Through
165 BGA
165 BGA
165 BGA
165 BGA
165 BGA
165 BGA
165 BGA
165 BGA
165 BGA
165 BGA
200/6.5
166/7
150/7.5
133/8.5
250/5.5
225/6
200/6.5
166/7
150/7.5
133/8.5
I
I
I
I
I
I
I
I
I
I
Ordering Information
Org
Part Number
1
Type
Package
Speed
2
(MHz/ns)
T
A3
Status
相關(guān)PDF資料
PDF描述
GS816132D-166I 165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816132D-200 165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816132D-200I 165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816132D-225 Pin Strip Header; No. of Contacts:36; Pitch Spacing:0.1"; No. of Rows:1; Contact Material:Copper Alloy; Contact Plating:Tin-Lead Over Nickel; Leaded Process Compatible:No; Mounting Type:PCB Straight Thru Hole RoHS Compliant: No
GS816132D-225I 165 Bump BGA?x18 Commom I/O?Top View (Package D)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
GS816132D-166I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816132D-200 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816132D-200I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816132D-225 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816132D-225I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
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