參數(shù)資料
型號: GS816118D-200I
廠商: Electronic Theatre Controls, Inc.
英文描述: 165 Bump BGA?x18 Commom I/O?Top View (Package D)
中文描述: 165焊球BGA封裝?x18 Commom的I / O?頂視圖(D組)
文件頁數(shù): 6/40頁
文件大小: 1391K
代理商: GS816118D-200I
6/8
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
Revision: 9/26/02
GS816118/32/36D
Supplemental Datasheet Information
Package Dimensions—165-Bump FPBGA (Package D)
A
B
C
D
E
F
G
H
I
J
K
L
M
N
P
R
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
1 2 3 4 5 6 7 8 9 10 11
11 10 9 8 7 6 5 4 3 2 1
A1 CORNER
TOP VIEW
A1 CORNER
BOTTOM VIEW
1.0
1.0
10.0
1
1
1
13±0.07
1
A
B
0.20(4x)
0.10
0.25
C
C A B
M
M
0.40~0.50 (165x)
C
SEATING PLANE
0
0
1
0
0
(
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相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
GS816118D-225 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816118D-225I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816118D-250 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816118D-250I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816118DD-150 制造商:GSI Technology 功能描述:165 BGA - Bulk