參數(shù)資料
型號: GS816118D-150I
廠商: Electronic Theatre Controls, Inc.
英文描述: 165 Bump BGA?x18 Commom I/O?Top View (Package D)
中文描述: 165焊球BGA封裝?x18 Commom的I / O?頂視圖(D組)
文件頁數(shù): 28/40頁
文件大小: 1391K
代理商: GS816118D-150I
Rev: 2.12 9/2002
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
20/32
1999, Giga Semiconductor, Inc.
GS816118/36T-250/225/200/166/150/133
Pipelined SCD Read Cycle Timing
Q1
A
Q3
A
Q2
D
Q2c
Q2
B
Q2
A
tKQ
tLZ
tOE
tOHZ
tOLZ
tKQX
tHZ
tKQX
CK
ADSP
ADSC
BW
G
GW
ADV
Burst Read
RD2
RD3
tKL
tS
tH
tH
tS tH
tS tH
ADSC initiated read
Suspend Burst
Single Read
ADSP is blocked by E inactive
A
0
–An
BW
A
–BW
D
tKH
tKC
tS
tH
tS
tS
tH
DQ
A
–DQ
D
RD1
Hi-Z
tH
E
1
masks ADSP
E
1
tS
相關(guān)PDF資料
PDF描述
GS816118D-166 Pin Strip Header; No. of Contacts:36; Pitch Spacing:0.1"; No. of Rows:2; Contact Material:Copper Alloy; Contact Plating:Gold; Leaded Process Compatible:Yes; Mounting Type:PCB Straight Thru Hole; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
GS816118D-166I 165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816118D-200 Pin Strip Header; No. of Contacts:36; Pitch Spacing:0.1"; No. of Rows:2; Contact Material:Copper Alloy; Contact Plating:Gold; Leaded Process Compatible:Yes; Mounting Type:PCB Straight Thru Hole; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes
GS816118D-200I 165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816118D-225 165 Bump BGA?x18 Commom I/O?Top View (Package D)
相關(guān)代理商/技術(shù)參數(shù)
參數(shù)描述
GS816118D-166 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816118D-166I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816118D-200 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816118D-200I 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)
GS816118D-225 制造商:未知廠家 制造商全稱:未知廠家 功能描述:165 Bump BGA?x18 Commom I/O?Top View (Package D)