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參數(shù)資料
| 型號(hào)： | GS8160Z36 |
| 廠商： | GSI TECHNOLOGY |
| 英文描述： | 16Mb Pipelined and Flow Through Synchronous NBT SRAM(16M位流水線式和流通型同步NBT靜態(tài)RAM) |
| 中文描述： | 16Mb的流水線和流量，通過(guò)同步唑的SRAM（1,600位流水線式和流通型同步唑靜態(tài)內(nèi)存） |
| 文件頁(yè)數(shù)： | 15/24頁(yè) |
| 文件大小： | 476K |
| 代理商： | GS8160Z36 |
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Rev: 2.08 11/2000
Specifications cited are subject to change without notice. For latest documentation see http://www.gsitechnology.com.
15/24
1998, Giga Semiconductor, Inc.
Preliminary
GS8160Z18/36T-225/200/180/166/150/133
AC Test Conditions
Notes:
1.
2.
3.
4.
Include scope and jig capacitance.
Test conditions as specified with output loading as shown in
Fig. 1
unless otherwise noted.
Output Load 2 for t
LZ
, t
HZ
, t
OLZ
and t
OHZ
Device is deselected as defined by the Truth Table.
Parameter
Input high level
Input low level
Input slew rate
Input reference level
Output reference level
Output load
Conditions
2.3 V
0.2 V
1 V/ns
1.25 V
1.25 V
Fig. 1& 2
DC Electrical Characteristics
Parameter
Input Leakage Current
(except mode pins)
Symbol
Test Conditions
Min
Max
I
IL
V
IN
= 0 to V
DD
–
1 uA
1 uA
ZZ Input Current
I
INZZ
V
DD
≥
V
IN
≥
V
IH
0 V
≤
V
IN
≤
V
IH
V
DD
≥
V
IN
≥
V
IL
0 V
≤
V
IN
≤
V
IL
Output Disable, V
OUT
= 0 to V
DD
I
OH
=
–
8 mA, V
DDQ
= 2.375 V
I
OH
=
–
8 mA, V
DDQ
= 3.135 V
I
OL
= 8 mA
–
1 uA
–
1 uA
1 uA
300 uA
Mode Pin Input Current
I
INM
–
300 uA
–
1 uA
1 uA
1 uA
Output Leakage Current
I
OL
V
OH
V
OH
V
OL
–
1 uA
1 uA
Output High Voltage
1.7 V
—
Output High Voltage
2.4 V
—
Output Low Voltage
—
0.4 V
DQ
VT = 1.25 V
50
30pF
*
DQ
2.5 V
Output Load 1
Output Load 2
225
225
5pF
*
* Distributed Test Jig Capacitance
相關(guān)PDF資料 |
PDF描述 |
|---|---|
| GS816118D-133 | Pin Strip Header; No. of Contacts:36; Pitch Spacing:0.1"; No. of Rows:2; Contact Material:Copper Alloy; Contact Plating:Gold; Leaded Process Compatible:Yes; Mounting Type:PCB Straight Thru Hole; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
| GS816118D-133I | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118D-150 | Pin Strip Header; No. of Contacts:36; Pitch Spacing:0.1"; No. of Rows:2; Contact Material:Copper Alloy; Contact Plating:Gold; Leaded Process Compatible:Yes; Mounting Type:PCB Straight Thru Hole; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
| GS816118D-150I | 165 Bump BGA?x18 Commom I/O?Top View (Package D) |
| GS816118D-166 | Pin Strip Header; No. of Contacts:36; Pitch Spacing:0.1"; No. of Rows:2; Contact Material:Copper Alloy; Contact Plating:Gold; Leaded Process Compatible:Yes; Mounting Type:PCB Straight Thru Hole; Peak Reflow Compatible (260 C):No RoHS Compliant: Yes |
相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| GS8160Z36BGT-150 | 制造商:GSI Technology 功能描述:SRAM SYNC SGL 2.5V/3.3V 18MBIT 512KX36 7.5NS/3.8NS 100TQFP - Trays |
| GS8160Z36BGT-150I | 制造商:GSI Technology 功能描述:SRAM SYNC SGL 2.5V/3.3V 18MBIT 512KX36 7.5NS/3.8NS 100TQFP - Trays |
| GS8160Z36BGT-150IT | 制造商:GSI Technology 功能描述:SRAM SYNC SGL 2.5V/3.3V 18MBIT 512KX36 7.5NS/3.8NS 100TQFP - Trays |
| GS8160Z36BGT-150IV | 制造商:GSI Technology 功能描述:SRAM SYNC QUAD 1.8V/2.5V 18MBIT 512KX36 7.5NS/3.8NS 100TQFP - Trays |
| GS8160Z36BGT-150T | 制造商:GSI 制造商全稱:GSI Technology 功能描述:18Mb Pipelined and Flow Through Synchronous NBT SRAM |
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