
CAUTION
ELECTROSTATIC SENSITIVE DEVICES
DO NOT OPEN PACKAGES OR HANDLE
EXCEPT AT A STATIC-FREE WORKSTATION
GENNUM CORPORATION
Mailing Address: P.O. Box 489, Stn. A, Burlington, Ontario, Canada L7R 3Y3
Shipping Address: 970 Fraser Drive, Burlington, Ontario, Canada L7L 5P5
Tel. +1 (905) 632-2996 Fax. +1 (905) 632-5946
GENNUM JAPAN CORPORATION
Shinjuku Green Tower Building 27F, 6-14-1, Nishi Shinjuku, Shinjuku-ku, Tokyo, 160-0023 Japan
Tel. +81 (03) 3349-5501, Fax. +81 (03) 3349-5505
GENNUM UK LIMITED
25 Long Garden Walk, Farnham, Surrey, England GU9 7HX
Tel. +44 (0)1252 747 000 Fax +44 (0)1252 726 523
Gennum Corporation assumes no liability for any errors or omissions in this document, or for the use of the
circuits or devices described herein. The sale of the circuit or device described herein does not imply any
patent license, and Gennum makes no representation that the circuit or device is free from patent infringement.
GENNUM and the G logo are registered trademarks of Gennum Corporation.
Copyright 2004 Gennum Corporation. All rights reserved. Printed in Canada.
www.gennum.com
GS1574A Data Sheet
33416 - 5
March 2006
16
16 of 16
DOCUMENT IDENTIFICATION
DATA SHEET
The product is in production. Gennum reserves the right to make
changes to the product at any time without notice to improve reliability,
function or design, in order to provide the best product possible.
7. Revision History
Version
ECR
PCN
Date
Changes and/or Modifications
0
136149
–
March 2005
Converted to Preliminary Data Sheet.
Updated typical application circuit.
Updated Input/Output circuits. Updated
AC and DC electrical characteristics.
Updated description of MUTE and CD
functionality. Correced minor typing
errors. Updated center pad dimensions
on PCB footprint.
1
136885
–
May 2005
Corrected description of connection for
AGC and AGC pins in the Pin
Description table. Clarified solder reflow
profile descriptions. Corrected minor
typing errors.
2
137167
–
June 2005
Rephrased RoHS compliance
statement.
3
137321
–
June 2005
Amended notes on use of MCLADJ
above 360 Mb/s.
4
137744
–
September 2005
Convert to Data Sheet. Corrected typing
errors. Corrected process to BiCMOS.
5
139634
38695
March 2006
Corrected pad standoff height and
tolerances for pad width & package
dimension. Corrected pad shape.