![](http://datasheet.mmic.net.cn/280000/GS-R51515S_datasheet_16060567/GS-R51515S_8.png)
8/8
The dissipatedpower in this operating condition is
about 7.4W (at typical efficiency of 81%), and the
case temperatureof the module will be:
T
case
=
T
amb
+
P
d
×
R
th
=
40
+
7.4
×
7.5
=
95.5
°
C
This valueexceedsthemaximumallowedtempera-
ture and an external heat-sink must be added. To
this purpose four holes (see mechanical drawing)
are providedon the metalsurface of the module.
Tocalculatethisheat-sink,let’sfirst determinewhat
the totalthermal resistance shouldbe:
R
th
=
T
case
(
max
)
T
amb
P
d
=
85
40
7.4
=
5.40
°
C
W
This value is the resulting value of the parallel
connection of GS-R thermal resistance and of the
additionalheatsink thermal resistance.
R
th
(
GSR
)
×
R
th
(
Heatsink
)
R
th
(
GSR
)
+
R
th
(
Heatsink
)
=
5.40
°
C / W
Tocalculatethethermalresistanceoftheadditional
heat-sink the followingequationmay be used:
R
th
(
Heatsink
) =
5.40
×
R
th
(
GSR
)
R
th
(
GSR
)
5,40
=
5.40
×
7.5
7.5
5.40
=
19.3
°
C / W
In insteadof or in addition to the external heatsink,
a forced ventilation with an air speed of about 200
linearfeet/minutecanbeusedreducingthethermal
resistance of the module at the specifiedvalue.
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsibility for the
consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from itsuse. No
license is granted by implication or otherwise under any patent or patentrights of SGS-THOMSON Microelectronics. Specification mentioned
in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied.
SGS-THOMSON Microelectronics products arenot authorized for use as criticalcomponents inlife support devices orsystems withoutexpress
written approval of SGS-THOMSON Microelectronics.
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GS-R51212S/GS-R51515S