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參數(shù)資料
| 型號(hào)： | GS-R1012 |
| 廠商： | 意法半導(dǎo)體 |
| 元件分類： | 基準(zhǔn)電壓源/電流源 |
| 英文描述： | RADIATION HARDENED HIGH EFFICIENCY, 5 AMP SWITCHING REGULATORS |
| 中文描述： | 抗輻射高效，5安培開關(guān)穩(wěn)壓器 |
| 文件頁(yè)數(shù)： | 5/7頁(yè) |
| 文件大?。?/td> | 88K |
| 代理商： | GS-R1012 |
5/7
Thermal characteristics: how to choose the
heat-sink
Sometimes the GS-R1012 requires an external
heat-sink depending both operating temperature
conditionsand power.
Beforeentering into calculationsdetails, some ba-
sic conceptswill be explainedto better understand
the problem.
The thermal resistance between two points is rep-
resentedby theirtemperaturedifferencein front of
a specifieddissipated power, andit is expressedin
Degree Centigrade per Watt (
°
C/W).
For GS-R1012 thethermal resistancecase to am-
bientis 7.5
°
C/W.Thismeansthatan internalpower
dissipationof 1Wwill bring thecase temperatureat
7.5
°
C abovethe ambient temperature.
The maximum case temperatureto which themod-
ule provides 10Ais 75
°
C (see fig. 6).
Let’s suppose to have a GS-R1012 that delivers a
load current of 10A at an ambient temperature of
40
°
C.
The dissipated power in thisoperating condition is
about 10.4W (at typicalefficiencyof 92%), and the
case temperatureof the modulewill be:
T
Case
=
T
Amb
+
P
d
×
R
th
=
40
+
10.4
×
7.5
=
118
°
C
Thisvalueexceedsthemaximum allowedtempera-
ture and an external heat-sink must be added. To
this purpose four holes (see mechanical drawing)
areprovided on the metal surface of the module.
Tocalculatethisheat-sink,let’s first determinewhat
the total thermal resistance should be.
R
th
=
T
CaseMAX
T
amb
P
d
=
75
40
10.4
=
3.37
°
C / W
This value is the resulting value of the additional
heatsinkthermal resistance.
Figure 3.
Figure4.
GS-R1012
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