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參數(shù)資料
| 型號： | GP401DDM18 |
| 廠商： | DYNEX SEMICONDUCTOR LTD |
| 元件分類： | 功率晶體管 |
| 英文描述： | OPTOISOLATOR W/BASE SMD |
| 中文描述： | 400 A, 1800 V, N-CHANNEL IGBT |
| 文件頁數(shù)： | 6/7頁 |
| 文件大小： | 95K |
| 代理商： | GP401DDM18 |
GP401DDM18
6/7
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
ASSOCIATED PUBLICATIONS
Title
Application Note
Number
AN4502
AN4503
AN4504
AN4505
AN4506
AN4507
AN4508
AN4869
AN5000
AN5167
AN5384
Electrostatic handling precautions
An introduction to IGBTs
IGBT ratings and characteristics
Heatsink requirements for IGBT modules
Calculating the junction temperature of power semiconductors
Gate drive considerations to maximise IGBT efficiency
Parallel operation of IGBTs
–
punch through vs non-punch through characteristics
Guidance notes for formulating technical enquiries
Principle of rating parallel connected IGBT modules
Short circuit withstand capability in IGBTs
Driving Dynex Semincoductor IGBT modules with Concept gate drivers
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic
semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
Solution (PACs).
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise
the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is
available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer
service office.
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相關(guān)代理商/技術(shù)參數(shù) |
參數(shù)描述 |
|---|---|
| GP401DDS18 | 制造商:DYNEX 制造商全稱:Dynex Semiconductor 功能描述:Low VCE(SAT) Dual Switch IGBT Module Preliminary Information |
| GP401LSS18 | 制造商:n/a 功能描述:Power Module |
| GP402 | 制造商:DEC 制造商全稱:DEC 功能描述:4 AMP HIGH RELIABILITY SOFT GLASS PASSIVATED SILICON DIODES |
| GP4020 | 制造商:ZARLINK 制造商全稱:Zarlink Semiconductor Inc 功能描述:GPS Receiver Baseband Processor |
| GP4020/IG | 制造商:ZARLINK 制造商全稱:Zarlink Semiconductor Inc 功能描述:GPS Receiver Baseband Processor |
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