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參數(shù)資料
| 型號： | GP2400ESM18 |
| 廠商： | DYNEX SEMICONDUCTOR LTD |
| 元件分類： | 功率晶體管 |
| 英文描述： | Hi-Reliability Single Switch IGBT Module |
| 中文描述： | 2400 A, 1800 V, N-CHANNEL IGBT |
| 文件頁數(shù)： | 11/12頁 |
| 文件大?。?/td> | 169K |
| 代理商： | GP2400ESM18 |
GP2400ESM12
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
11/12
ASSOCIATED PUBLICATIONS
Title
Application Note
Number
AN4502
AN4503
AN4504
AN4505
AN4506
AN4507
AN4508
AN4869
AN5000
AN5167
AN5190
Electrostatic handling precautions
An introduction to IGBTs
IGBT ratings and characteristics
Heatsink requirements for IGBT modules
Calculating the junction temperature of power semiconductors
Gate drive considerations to maximise IGBT efficiency
Parallel operation of IGBTs – punch through vs non-punch through characteristics
Guidance notes for formulating technical enquiries
Principle of rating parallel connected IGBT modules
Short circuit withstand capability in IGBTs
Driving high power IGBTs with concept gate drivers
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than a basic semiconductor
switch, and has developed a flexible range of heatsink / clamping systems in line with advances in device types and the voltage and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
solution (PACs).
HEATSINKS
Power Assembly has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise the
performance or our semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is available on
request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest Sales Representative or the
factory.
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PDF描述 |
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| GP250MHB06S | Half Bridge IGBT Module |
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相關代理商/技術參數(shù) |
參數(shù)描述 |
|---|---|
| GP2400ESS18 | 制造商:n/a 功能描述:IGBT Module |
| GP24015 | 制造商:Nordic Power i Stromstad 功能描述:Bulk |
| GP2401ESM18 | 制造商:DYNEX 制造商全稱:Dynex Semiconductor 功能描述:Hi-Reliability Single Switch Low VCE(SAT) IGBT Module |
| GP24030 | 制造商:Nordic Power i Stromstad 功能描述:Bulk |
| GP24-047X0438-50 | 制造商:GROOV-PIN 功能描述: |
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