
Ver: 1.0
Mar 22, 2002
TEL: 886-3-5788833
http://www.gmt.com.tw
2
G901
Global Mixed-mode Technology Inc.
Absolute Maximum Ratings
(Note 1)
Input Voltage………………………………….……….10V
Power Dissipation Internally Limited (Note2)
Maximum Junction Temperature………….………150°C
Storage Temperature Range..….…-65°C
≤
T
J
≤
+150°C
Lead Temperature, Time for Wave Soldering
SOT89 Package……..……..……………….....260°C, 4s
Continuous Power Dissipation (T
A
= + 25°C)
SOT 89
(1)
………………………….…………………..0.5W
Note
(1)
: See Recommended Minimum Footprint.
Operating Conditions
(Note 1)
Input Voltage…………………………...…………4V ~ 7V
Temperature Range……………….…...0°C
≤
T
J
≤
125°C
Electrical Characteristics
V
IN
=5V, I
O
= 300mA, C
IN
=1μF, C
OUT
=10μF. All specifications apply for T
A
= T
J
= 25°C.[Note 3]
PARAMETER
Output Voltage
Line Regulation
Load Regulation
Output Impedance
Quiescent Current
Ripple Rejection
CONDITIONS
MIN
3.201
TYP
3.3
3
28
102
0.6
42
450
50
0.77
150
MAX
3.399
100
UNITS
V
mV
mV
m
mA
dB
5mA < I
O
<300mA
4V < V
IN
< 6.5V, I
O
= 50mA
10mA < I
O
< 300mA
100mA DC and 100mA AC, f
O
= 120Hz
V
IN
= 5V
f
i
= 120 Hz, 1V
P-P
, Io = 100mA
I
O
= 300mA
I
O
= 50mA
Dropout Voltage
mV
Short Circuit Current
Over Temperature
Note 1:
Absolute Maximum Ratings are limits beyond which damage to the device may occur. Operating
Conditions are conditions under which the device functions but the specifications might not be guaranteed. For
guaranteed specifications and test conditions see the Electrical Characteristics.
Note 2:
The maximum power dissipation is a function of the maximum junction temperature, T
Jmax
; total thermal re-
sistance,
θ
JA
, and ambient temperature T
A
. The maximum allowable power dissipation at any ambient
temperature is T
Jmax
-T
A
/
θ
JA
. If this dissipation is exceeded, the die temperature will rise above 150°C and
IC will go into thermal shutdown. For the G901 in SOT89 package,
θ
JA
is 250°C/W(See recommend
minimum footprint). The safe operation in SOT 89, it can see ”Typical Performance Characteristics” (Safe
Operating Area).
Note3:
Low duty pulse techniques are used during test to maintain junction temperature as close to ambient as pos-
sible.
Note4:
The type of output capacitor should be tantalum or aluminum.
Definitions
Dropout Voltage
The input/output Voltage differential at which the regu-
lator output no longer maintains regulation against
further reductions in input voltage. Measured when the
output drops 100mV below its nominal value, dropout
voltage is affected by junction temperature, load cur-
rent and minimum input supply requirements.
Line Regulation
The change in output voltage for a change in input
voltage. The measurement is made under conditions
of low dissipation or by using pulse techniques such
that average chip temperature is not significantly af-
fected.
A
°C
Load Regulation
The change in output voltage for a change in load
current at constant chip temperature. The measure-
ment is made under conditions of low dissipation or by
using pulse techniques such that average chip tem-
perature is not significantly affected.
Maximum Power Dissipation
The maximum total device dissipation for which the
regulator will operate within specifications.
Quiescent Bias Current
Current which is used to operate the regulator chip
and is not delivered to the load.