
Precautions
Surface Temperature of PC Board VS. Recommended Soldering Time
1.
VPS
2. IRS
Time (s)
T
ime (s)
215 C
max.
Preheating
Soldering
Air
cooling
T
e
T
e
220
to
240
180
to
200
150
20 to 30
215
180
to
200
90
to
100
90 to 120
40 to 60
Preheating
Soldering
Air
cooling
90 to 120
3. Other Considerations
Soldering
iron heat
T
emperature at tip: 280
C to 300
C
Power: 30 W to 60 W
Heating time: 3 s to 5 s
When soldering with a pulse heater, hot air, or laser, take into
account
such factors as heat stress, and test the process under
actual
conditions.
Mounting
Can be mounted in any orientation.
Not suitable for socket mounting.
Do not reverse the coil polarity
.
The diagram below the minimum spacing necessary when
mounting
more than one relay on a printed circuit board.
Surface
Mounting T
erminals
2,54
mm min.
Terminals
L Terminals (G6H–2F)
Characteristics
Soldering methods
IRS (Infrared radiation furnace)
VPS (V
apor phase)
Removal and replacement is simple.
Glue pads
Glue Pads
Glue pads are projections from the relay case where adhesive is
applied to temporarily attach the relay to the printed circuit board
before soldering. The soldering points are where solder is
applied
during soldering.
Glue pads are for use with epoxy or UV adhesives. Glue pads
are located on the sides to allow UV illumination and adhesive
curing.
T
wo points are provided for stability
.
Orientation Marks
These
marks are provided to properly
position the relays when they
are
supplied to the printed circuit board automatically
. T
wo types of
orientation
marks are provided.
Mechanical:
A U-shaped impression along the top edge is used
for
alignment.
Optical: A dark mark on the top surface is used for alignment.
Cleaning Methods
Brushing
Dipping
Fine
as long as the detergent has no chemical
or electrical af
fect on the relay
.
Spraying
Vapor
Hot water
Ultrasonic
Fine as long as the detergent has no chemical
or electrical af
fect on the relay
. The model
number of the ultrasound cleaning-type relay
ends in “-U”.