參數(shù)資料
型號: FST3384A
文件頁數(shù): 173/178頁
文件大?。?/td> 3973K
代理商: FST3384A
Preliminary
1999 Fairchild Semiconductor Corporation
DS500209
www.fairchildsemi.com
December 1998
Revised December 1999
F
FSTU6800A
10-Bit Bus Switch with Pre-Charged Outputs
and
2V Undershoot Hardened Circuit (UHC
) Protection
(Preliminary)
General Description
The Fairchild Switch FSTU6800A provides 10-bits of high-
speed CMOS TTL-compatible bus switching. The low on
resistance of the switch allows inputs to be connected to
outputs without adding propagation delay or generating
additional ground bounce noise. Both the A Ports and the B
Ports are “undershoot hardened” with UHC
protection to
support an extended input range to 2.0V below ground.
Fairchild’s integrated Undershoot Hardened Circuit, UHC
senses undershoot at the I/Os, and responds by preventing
voltage differentials from developing and turning on the
switch. The device also precharges the B Port to a select-
able bias voltage (BiasV) to minimize live insertion noise.
The device is organized as a 10-bit switch with a bus
enable (OE) signal. When OE is LOW, the switch is ON
and Port A is connected to Port B. When OE is HIGH, the
switch is OPEN and the B Port is precharged to BiasV
through an equivalent 10-k
resistor.
Features
I
4
switch connection between two ports.
I
Undershoot Hardened to -2.0V.
I
Soft enable turn-on to minimize bus-to-bus charge
sharing during enable.
I
Low l
CC
.
I
Zero bounce in flow-through mode.
I
Output precharge to minimize live insertion noise.
I
Control inputs compatible with TTL level.
I
See Applications Note AN-5008 for details.
Ordering Code:
Devices also available in Tape and Reel. Specify by appending the suffix letter “X” to the ordering code.
UHC
is a trademark of Fairchild Semiconductor Corporation.
Order Number
FSTU6800AWM
FSTU6800AQSC
FSTU6800AMTC
Package Number
M24B
MQA24
MTC24
Package Description
24-Lead Small Outline Integrated Circuit (SOIC), JEDEC MO-153 4.4mm Wide
24-Lead Quarter Size Outline Package (QSOP), JEDEC MO-137, 0.150” Wide
24-Lead Thin Shrink Small Outline Package (TSSOP), JEDEC MO-153, 4.4mm Wide
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