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參數(shù)資料
| 型號： | FSA110K8X |
| 廠商： | Fairchild Semiconductor |
| 文件頁數(shù)： | 3/12頁 |
| 文件大小： | 0K |
| 描述： | IC SWITCH AUD/WIRED-OR 8-VSOP |
| 標準包裝： | 1 |
| 應用： | USB |
| 接口： | USB |
| 電源電壓： | 2.7 V ~ 4.3 V |
| 封裝/外殼： | 8-VFSOP（0.091"，2.30mm 寬） |
| 供應商設備封裝： | US8 |
| 包裝： | 標準包裝 |
| 安裝類型： | 表面貼裝 |
| 產(chǎn)品目錄頁面： | 1218 (CN2011-ZH PDF) |
| 其它名稱： | FSA110K8XDKR |
2007 Fairchild Semiconductor Corporation
www.fairchildsemi.com
FSA110 Rev. 1.0.2
11
FSA110
—
Audio
and
Wired-
OR
USB2.0
Hi-Speed
Switch
wit
h
Negative
Signa
lCapability
an
d
Built-
in
Terminatio
n
Physical Dimensions
A. DIMENSIONS ARE IN MILLIMETERS.
B. DIMENSIONS AND TOLERANCES PER
ASME Y14.5M, 1994
TOP VIEW
BOTTOM VIEW
RECOMMENDED LAND PATTERN
0.15 C
0.08 C
B
A
C
0.15 C
2X
SIDE VIEW
SEATING
PLANE
0.10 C
0.050
3
6
1
0.10 C A B
0.05 C
0.55 MAX.
PIN #1 QUADRANT
10
1.40
1.80
0.40
0.15
0.25
10X
0.45
0.55
0.35
0.45
9X
1.700
2.100
0.400
0.663
0.563
9X
0.225
10X
1
0.152
0.100
0.500
0.100
DETAIL A
PIN #1 TERMINAL
SCALE: 2X
1.850
1.450
0.550
0.400
0.225
10X
9X
0.450
OPTIONAL MINIMIAL TOE LAND PATTERN
C. DRAWING FILENAME: UMLP10Arev2
Figure 20.
10-Lead Quad Ultrathin Molded Leadless Package (MLP)
Package drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner
without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or
obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions,
specifically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
http://www.fairchildsemi.com/packaging/
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