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參數(shù)資料
| 型號(hào)： | FS-335 |
| 廠商： | 愛普生（中國(guó)）有限公司 |
| 英文描述： | SAW Resonator For Small Wireless Equipment(用于小型無(wú)線設(shè)備的鋸齒型共鳴器) |
| 中文描述： | 聲表面波諧振器對(duì)于小型無(wú)線設(shè)備（用于小型無(wú)線設(shè)備的鋸齒型共鳴器） |
| 文件頁(yè)數(shù)： | 1/1頁(yè) |
| 文件大?。?/td> | 55K |
| 代理商： | FS-335 |
SAW device
2,5
1,3,4,6
IN/OUT
GND
NO.
1
1
1
1
3
(Unit: mm)
(Unit: mm)
External dimensions
Specifications (characteristics)
Recommended soldering pattern
433
07
E
2.54
1.05
1.27
2
1
Connection
1
2
3
0.64
6
5
4
1.27
2.54
3.8
SAW RESONATOR
FS-335
Reflow solderable SMD ceramic package.
Capable of covering a wide frequency range, from 300 MHz to 900 MHz.
1.3 mm thickness is equal to SMD-type IC.
Perfect for small wireless equipment.
Excellent shock resistance and enviromental capability (prevention for
contamination)
Item
Nominal frequency range
Temperature
range
Storage temperature
Operating temperature
Recommended drive level
Frequency tolerance
(standard)
Peak temperature
Temperature coefficient
Harmonic ratio
Series resistance
Motional capacitance
Shunt capacitance
Insulation resistance
Aging
Shock resistance
Symbol
f
0
T
STG
T
OPR
GL
DL
f/f
θ
T
α
R
S
/R
1
R
1
C
1
C
0
IR
fa
S.R.
Specifications
300 MHz to 900 MHz
-40
°
C to +85
°
C
-40
°
C to +85
°
C
10 mW Max.
2 mW Max.
1 mW Typ.
±25 x 10
-6
, ±50 x 10
-6
,±100 x 10
-6
±100 x 10
-6
+25
°
C ± 15
°
C
(-3.4±0.8) x 10
-8
/
°
C
2
2 Min.
25
Max.
30
Max.
2.6 fF Typ.
4.3 pF Typ.
500 M
Min.
±10 x 10
-6
/year Max.
±10 x 10
-6
Max.
Remarks
Stored as bare product after unpacking
300 MHz
≤
f
0
≤
500 MHz, Ta=+25
°
C ± 3
°
C
500 MHz < f
0
≤
900 MHz, Ta=+25
°
C ± 3
°
C
300 MHz
≤
f
0
≤
500 MHz, Ta=+25
°
C
500 MHz < f
0
≤
900 MHz, Ta=+25
°
C
(f
0
=312.24 MHz)
(f
0
=312.24 MHz)
Ta=+25
°
C ±3
°
C
Nine
drops on a concrete
from 1500 mm
Maximum drive level
300 MHz
≤
f
0
≤
500 MHz
500 MHz < f
0
≤
900 MHz
Actual size
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